IS42S32160F-6TLI

The IS42S32160F-6TLI is a volatile SDRAM device offering 512 Mbit of parallel DRAM organized as 16M x 32. It provides a parallel memory interface with a 167 MHz clock frequency and a typical access time of 5.4 ns.

Designed for systems that require high-density parallel SDRAM in a compact board footprint, the device operates from a 3.0 V to 3.6 V supply and is specified for an ambient temperature range of −40°C to 85°C. Packaging is an 86‑TSOP II (0.400", 10.16 mm width) suitable for surface-mount applications.

Key Features

• Memory Core 512 Mbit SDRAM organized as 16M x 32, providing high-density parallel memory in a single device.
• Performance 167 MHz clock frequency with a 5.4 ns access time for responsive random access performance.
• Interface Parallel DRAM memory interface suitable for designs using conventional parallel memory buses.
• Power Operates from a 3.0 V to 3.6 V supply range to match common 3 V DRAM power domains.
• Package 86‑TSOP II surface-mount package (86‑TFSOP, 0.400", 10.16 mm width) for compact board-level integration.
• Operating Range Specified for ambient temperatures from −40°C to 85°C (TA), supporting a broad thermal operating window.

Typical Applications

• Parallel memory subsystems Provides 512 Mbit parallel SDRAM capacity (16M x 32) for systems requiring board-mounted DRAM devices.
• Embedded designs Fits designs that need a compact, high-density SDRAM component with a 3.0–3.6 V supply and wide temperature range.
• PCB surface-mount implementations Suited for layouts that use an 86‑TSOP II (0.400", 10.16 mm) package for space-constrained boards.

Unique Advantages

• High-density single-device memory: 512 Mbit capacity in a single 16M x 32 device reduces component count compared to multiple lower-density parts.
• Measured access performance: 5.4 ns access time combined with a 167 MHz clock supports responsive memory access patterns.
• Standard parallel interface: Parallel DRAM interface simplifies integration into existing parallel memory architectures.
• Wide operating temperature: −40°C to 85°C rating enables deployment across a broad range of ambient conditions.
• Compact TSOP II package: 86‑TSOP II (0.400", 10.16 mm width) enables dense board placement and surface-mount assembly.
• Flexible supply range: 3.0 V to 3.6 V operation aligns with typical 3 V DRAM power domains for easier power design.

Why Choose IS42S32160F-6TLI?

The IS42S32160F-6TLI positions as a high-density parallel SDRAM option delivering 512 Mbit in a compact 86‑TSOP II package with a 16M x 32 organization, 167 MHz clocking, and a 5.4 ns access time. Its 3.0–3.6 V supply range and −40°C to 85°C operating window make it suitable for a wide range of board-level memory applications where verified parallel DRAM performance and space-efficient packaging are required.

This device is appropriate for designers and procurement teams seeking a single-device memory solution that combines density, defined access characteristics, and an industry-standard TSOP II footprint for straightforward PCB integration.

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