IS42S32200C1-6TL

IC DRAM 64MBIT PAR 86TSOP II
Part Description

IC DRAM 64MBIT PAR 86TSOP II

Quantity 1,449 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.5 nsGradeCommercial
Clock Frequency166 MHzVoltage3.15V ~ 3.45VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization2M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S32200C1-6TL – IC DRAM 64MBIT PAR 86TSOP II

The IS42S32200C1-6TL is a 64-Mbit synchronous DRAM organized as 512K×32×4 (4 banks) that delivers high-speed, burst-oriented data transfers using a pipeline architecture. It is designed for 3.3V memory systems with an LVTTL interface and supports programmable burst lengths and sequences for flexible data access patterns.

This device is intended for use in systems that require synchronous, high-rate parallel memory access with internal bank interleaving and self-refresh capabilities to manage refresh cycles and power-saving modes.

Key Features

  • Memory Architecture  64 Mbit SDRAM organized as 512K bits × 32 bits × 4 banks, enabling internal bank interleaving and improved random-access performance.
  • Synchronous Pipeline Operation  Fully synchronous design with all signals registered on the rising edge of CLK for predictable timing and pipelined data transfers.
  • Clock and Timing  Supported clock frequency grades include 183, 166, and 143 MHz. Programmable CAS latency options of 2 or 3 clocks and access times down to 5.5 ns (CAS latency = 3) are provided.
  • Burst Control  Programmable burst lengths (1, 2, 4, 8, full page) and burst sequence modes (sequential/interleave) with burst termination via burst stop or precharge command.
  • Refresh and Power Modes  Auto refresh and self-refresh modes with 4096 refresh cycles every 64 ms plus a power-down mode for reduced power during idle periods.
  • Interface and Logic Levels  LVTTL-compatible input/output signaling and a single 3.3V power supply (specified supply range 3.15 V to 3.45 V).
  • Package and Temperature  Available in a 86-pin TSOP II (400-mil, 10.16 mm width) package; device literature notes availability in industrial temperature grades. Specified commercial operating range is 0°C to 70°C (TA).

Typical Applications

  • 3.3V memory subsystems  Designed for systems operating with a 3.3V supply that require synchronous parallel DRAM for high-rate data transfers.
  • High-speed burst data buffering  Programmable burst lengths and pipeline architecture support burst-oriented read/write operations for burst buffering use cases.
  • Systems requiring bank interleaving  Quad-bank organization and internal precharge hiding enable reduced latency for random-access patterns across multiple banks.

Unique Advantages

  • Quad-bank internal organization: Four internal banks allow precharge hiding and interleaving to improve effective throughput for staggered accesses.
  • Flexible burst operation: Programmable burst length and sequence options let designers tailor transfers for sequential or interleaved data patterns.
  • Multiple speed grades: Offered in 183/166/143 MHz clock grades with CAS latency options, enabling selection for specific timing requirements.
  • Synchronous pipeline design: All signals referenced to the positive clock edge for consistent timing and predictable integration into synchronous memory systems.
  • Standard 3.3V LVTTL interface: Simplifies interface design in 3.3V systems while supporting LVTTL signaling for compatibility with common logic families.
  • Package options and temperature availability: Supplied in 86-pin TSOP II (400-mil) and noted as available in industrial temperature grades to match form-factor and thermal requirements.

Why Choose IS42S32200C1-6TL?

The IS42S32200C1-6TL provides a synchronous, pipelined 64-Mbit DRAM solution optimized for 3.3V memory systems that require programmable burst behavior, internal bank interleaving, and LVTTL I/O. Its multiple speed grades and CAS latency options let designers balance timing and throughput to meet system requirements.

This device is well suited for designs needing predictable, burst-oriented parallel memory with on-chip refresh management and package options for space-constrained board layouts. The documented timing parameters and supply range support engineering evaluation and integration into synchronous memory subsystems.

Request a quote or submit an inquiry to receive pricing and availability information for the IS42S32200C1-6TL.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up