IS42S32400E-7TL-TR
| Part Description |
IC DRAM 128MBIT PAR 86TSOP II |
|---|---|
| Quantity | 376 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S32400E-7TL-TR – IC DRAM 128MBIT PAR 86TSOP II
The IS42S32400E-7TL-TR is a 128 Mbit synchronous DRAM organized as 4M × 32 with a quad-bank architecture and pipeline operation. It is designed for 3.3 V memory systems and uses fully synchronous operation with all signals referenced to the rising clock edge.
This device targets systems requiring a 128 Mb SDRAM in a compact 86-pin TSOP-II package, offering programmable burst and latency options alongside standard SDRAM refresh and power characteristics.
Key Features
- Memory Core — 128 Mbit capacity organized as 1M × 32 × 4 banks (4M × 32 logical organization), providing quad-bank operation for improved row access handling.
- Synchronous SDRAM — Fully synchronous operation with pipeline architecture; all I/O referenced to the positive clock edge for deterministic timing.
- Performance — Rated for 143 MHz clock frequency (–7 speed grade) with an access time from clock of 5.4 ns at CAS latency = 3.
- Programmability — Programmable burst length (1, 2, 4, 8, full page), programmable burst sequence (sequential/interleave), and programmable CAS latency (2 or 3 clocks).
- Refresh and Power — Auto Refresh (CBR) and Self Refresh supported; 4096 refresh cycles with refresh interval depending on device grade. Single power supply operation around 3.3 V (3.0 V to 3.6 V specified).
- Interface — LVTTL-compatible signaling and parallel memory interface suitable for synchronous memory subsystems.
- Package & Temperature — 86-pin TSOP-II (0.400", 10.16 mm width) package; commercial operating temperature range 0°C to +70°C.
Typical Applications
- 3.3 V Memory Subsystems — Provides 128 Mb of synchronous DRAM for systems designed around a 3.3 V memory bus.
- Embedded and Board-Level Designs — Compact 86-pin TSOP-II package fits space-constrained PCBs requiring parallel SDRAM.
- Data Buffering — Programmable burst and latency options support burst read/write and burst read/single write operations for buffering and streaming data use cases.
Unique Advantages
- Deterministic synchronous timing: Fully synchronous, pipeline architecture with signals referenced to the rising clock edge simplifies timing implementation.
- Speed-grade matched performance: –7 speed grade delivers 143 MHz operation and a 5.4 ns access time at CAS latency = 3 for predictable throughput.
- Flexible burst and latency control: Programmable burst length, sequence and CAS latency let designers tune transfer behavior to system needs.
- Single-supply operation: 3.0 V to 3.6 V supply range (nominal 3.3 V) reduces power-rail complexity in 3.3 V memory systems.
- Standard package footprint: 86-TSOP II package (10.16 mm width) supports compact board layouts and common assembly processes.
- Built-in refresh management: Auto and self refresh with 4096 refresh cycles accommodate standard SDRAM refresh requirements across device grades.
Why Choose IC DRAM 128MBIT PAR 86TSOP II?
The IS42S32400E-7TL-TR combines a 128 Mbit SDRAM density with a quad-bank, fully synchronous architecture and configurable burst/latency options, making it suitable for designs that require predictable, high-speed SDRAM behavior on a 3.3 V bus. Its –7 speed grade performance, standard LVTTL interface, and compact 86-pin TSOP-II packaging support integration into constrained board-level applications.
Choose this device when you need a verified synchronous DRAM building block with programmable transfer modes, standard refresh options, and a commercial temperature rating for mainstream embedded and system memory applications.
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