IS42S32400E-7BL-TR
| Part Description |
IC DRAM 128MBIT PAR 90TFBGA |
|---|---|
| Quantity | 918 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S32400E-7BL-TR – IC DRAM 128MBIT PAR 90TFBGA
The IS42S32400E-7BL-TR is a 128 Mbit synchronous DRAM organized as 4M × 32 with internal quad-bank architecture and pipeline operation for high-speed data transfer. It is a single-supply 3.3 V SDRAM device available in a 90-ball TF-BGA (8×13) package and specified for commercial temperature operation.
This device is intended for designs requiring a parallel SDRAM interface with programmable burst control, selectable CAS latency and fast access timing, delivering predictable timing for high-performance memory subsystems.
Key Features
- Core Architecture Quad-bank SDRAM with pipeline architecture and internal bank management to hide row access/precharge and support continuous data flow.
- Memory Organization 128 Mbit capacity organized as 4M × 32 (1M × 32 × 4 banks) for parallel bus systems.
- Clock and Timing Clock frequency options of 166, 143, and 133 MHz. The -7 speed grade (this part) is specified at 143 MHz with an access time from clock of 5.4 ns at CAS latency = 3.
- Programmable Burst and CAS Programmable burst lengths (1, 2, 4, 8, full page) and programmable burst sequence (sequential/interleave). CAS latency selectable between 2 and 3 clocks.
- Refresh and Self-Refresh Auto and self-refresh supported. Refresh options include 4096 cycles per refresh interval (A2 grade: 16 ms; Commercial/Industrial/A1 grade: 64 ms) as defined in the device options.
- Interface and Signaling LVTTL-compatible interface with fully synchronous operation where all signals are referenced to the positive clock edge.
- Power Single power supply: 3.3 V ±0.3 V (documented supply range 3.0–3.6 V).
- Package and Temperature 90-TFBGA (8×13) package; commercial operating temperature range 0°C to +70°C (TA).
Typical Applications
- High-speed memory subsystems Used where a parallel 128 Mbit SDRAM is required to provide predictable, clocked data transfers and burst operations.
- Embedded systems Suited for embedded designs that need a 3.3 V synchronous DRAM in a compact TF-BGA package and commercial temperature operation.
- Buffering and data streaming Programmable burst lengths, interleave/sequential modes and quad-bank architecture make it appropriate for buffering and streaming data paths.
Unique Advantages
- Flexible timing configurations Selectable CAS latency (2 or 3) and multiple clock-frequency options enable designers to tune latency and throughput to system requirements.
- Burst programmability Multiple burst lengths and sequence modes allow optimization of sequential and random access patterns to improve data throughput efficiency.
- Banked architecture for throughput Internal quad-bank design and bank-level hiding of row operations reduce effective access penalties during interleaved accesses.
- Compact board footprint 90-ball TF-BGA (8×13) package provides a small form factor for space-constrained PCB layouts.
- Standard 3.3 V supply Single-supply operation at 3.3 V ±0.3 V simplifies power delivery and integration with common 3.3 V system rails.
Why Choose IS42S32400E-7BL-TR?
The IS42S32400E-7BL-TR offers a balanced combination of programmable burst control, selectable CAS latency, and a quad-bank synchronous DRAM architecture to meet demands for predictable, high-speed parallel memory in commercial-temperature designs. Its 90-TFBGA package and 3.3 V single-supply operation make it suitable where board space and standard system voltages are primary considerations.
This device is appropriate for engineers and procurement teams specifying a 128 Mbit SDRAM with configurable timing and refresh options, and for systems that benefit from LVTTL signaling and pipeline synchronous operation.
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