IS42S32400F-6BL-TR
| Part Description |
IC DRAM 128MBIT PAR 90TFBGA |
|---|---|
| Quantity | 832 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S32400F-6BL-TR – IC DRAM 128MBIT PAR 90TFBGA
The IS42S32400F-6BL-TR is a 128 Mbit parallel SDRAM organized as 4M × 32 in a 90‑TFBGA (8×13) package. It operates from a 3.0 V to 3.6 V supply and targets systems that require external volatile SDRAM storage with parallel bus interfacing.
With a clock frequency of 166 MHz and an access time of 5.4 ns, this device supports applications that need moderate-speed parallel memory in compact BGA packaging within an operating ambient range of 0°C to 70°C.
Key Features
- Memory Core 128 Mbit SDRAM organized as 4M × 32, providing a wide 32-bit data path for parallel memory access.
- Performance 166 MHz clock frequency and 5.4 ns access time to support moderate-speed data transfer and random access operations.
- Interface Parallel memory interface suitable for systems designed around external SDRAM devices.
- Power Operating voltage range of 3.0 V to 3.6 V to match common 3 V SDRAM power rails.
- Package 90‑TFBGA (8×13) supplier device package for compact board-level integration.
- Operating Range Ambient operating temperature specified as 0°C to 70°C (TA).
Typical Applications
- Embedded Systems — External parallel SDRAM for embedded designs that require 128 Mbit of volatile storage with a 32-bit data bus.
- Consumer Electronics — On-board parallel SDRAM for devices needing compact BGA packaging and 3.0–3.6 V operation.
- Communications Equipment — Parallel memory for buffering and frame storage in systems leveraging a 166 MHz clock and 5.4 ns access characteristics.
Unique Advantages
- Wide 32‑bit Organization: 4M × 32 configuration delivers a broad data path for parallel transfers, simplifying host bus integration.
- Moderate High‑Speed Operation: 166 MHz clock and 5.4 ns access time provide measurable performance for time-sensitive memory operations.
- BGA Space Savings: 90‑TFBGA (8×13) package minimizes PCB footprint while keeping the device surface-mount compatible.
- Standard 3 V Supply Range: 3.0 V to 3.6 V operation aligns with common SDRAM power rails for straightforward power design.
- Clear Thermal Spec: Specified operating ambient range of 0°C to 70°C enables deployment in typical commercial-temperature environments.
Why Choose IS42S32400F-6BL-TR?
The IS42S32400F-6BL-TR delivers a compact, parallel SDRAM solution combining a 4M × 32 memory organization, 166 MHz clock capability, and a 90‑TFBGA package. Its electrical and timing specifications make it suitable for designers needing a 128 Mbit volatile memory device with a standard 3.0–3.6 V supply and defined commercial temperature range.
This device fits designs where a wide parallel data bus, predictable access time, and space-efficient BGA packaging are priorities, offering a straightforward option for applications requiring on-board SDRAM storage.
Request a quote or contact sales for pricing, lead times, and availability for IS42S32400F-6BL-TR.