IS42S32400F-6BL-TR

IC DRAM 128MBIT PAR 90TFBGA
Part Description

IC DRAM 128MBIT PAR 90TFBGA

Quantity 832 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package90-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging90-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S32400F-6BL-TR – IC DRAM 128MBIT PAR 90TFBGA

The IS42S32400F-6BL-TR is a 128 Mbit parallel SDRAM organized as 4M × 32 in a 90‑TFBGA (8×13) package. It operates from a 3.0 V to 3.6 V supply and targets systems that require external volatile SDRAM storage with parallel bus interfacing.

With a clock frequency of 166 MHz and an access time of 5.4 ns, this device supports applications that need moderate-speed parallel memory in compact BGA packaging within an operating ambient range of 0°C to 70°C.

Key Features

  • Memory Core 128 Mbit SDRAM organized as 4M × 32, providing a wide 32-bit data path for parallel memory access.
  • Performance 166 MHz clock frequency and 5.4 ns access time to support moderate-speed data transfer and random access operations.
  • Interface Parallel memory interface suitable for systems designed around external SDRAM devices.
  • Power Operating voltage range of 3.0 V to 3.6 V to match common 3 V SDRAM power rails.
  • Package 90‑TFBGA (8×13) supplier device package for compact board-level integration.
  • Operating Range Ambient operating temperature specified as 0°C to 70°C (TA).

Typical Applications

  • Embedded Systems — External parallel SDRAM for embedded designs that require 128 Mbit of volatile storage with a 32-bit data bus.
  • Consumer Electronics — On-board parallel SDRAM for devices needing compact BGA packaging and 3.0–3.6 V operation.
  • Communications Equipment — Parallel memory for buffering and frame storage in systems leveraging a 166 MHz clock and 5.4 ns access characteristics.

Unique Advantages

  • Wide 32‑bit Organization: 4M × 32 configuration delivers a broad data path for parallel transfers, simplifying host bus integration.
  • Moderate High‑Speed Operation: 166 MHz clock and 5.4 ns access time provide measurable performance for time-sensitive memory operations.
  • BGA Space Savings: 90‑TFBGA (8×13) package minimizes PCB footprint while keeping the device surface-mount compatible.
  • Standard 3 V Supply Range: 3.0 V to 3.6 V operation aligns with common SDRAM power rails for straightforward power design.
  • Clear Thermal Spec: Specified operating ambient range of 0°C to 70°C enables deployment in typical commercial-temperature environments.

Why Choose IS42S32400F-6BL-TR?

The IS42S32400F-6BL-TR delivers a compact, parallel SDRAM solution combining a 4M × 32 memory organization, 166 MHz clock capability, and a 90‑TFBGA package. Its electrical and timing specifications make it suitable for designers needing a 128 Mbit volatile memory device with a standard 3.0–3.6 V supply and defined commercial temperature range.

This device fits designs where a wide parallel data bus, predictable access time, and space-efficient BGA packaging are priorities, offering a straightforward option for applications requiring on-board SDRAM storage.

Request a quote or contact sales for pricing, lead times, and availability for IS42S32400F-6BL-TR.

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