IS42S32400F-6BL
| Part Description |
IC DRAM 128MBIT PAR 90TFBGA |
|---|---|
| Quantity | 1,241 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S32400F-6BL – IC DRAM 128MBIT PAR 90TFBGA
The IS42S32400F-6BL is a 128 Mbit parallel SDRAM device organized as 4M × 32, providing volatile off-chip memory for systems that require high-throughput buffering and working storage. Built as a synchronous DRAM (SDRAM) in a compact 90‑TFBGA (8×13) package, it targets applications that need a standard 3.0–3.6 V supply and commercial temperature operation.
Key Features
- Memory 128 Mbit capacity organized as 4M × 32, delivering a wide 32‑bit data path for parallel system architectures.
- Technology SDRAM (synchronous dynamic RAM) providing standard DRAM functionality for system memory and buffering.
- Performance 166 MHz clock frequency with a 5.4 ns access time to support fast data transfer and low-latency access patterns.
- Power Operates from a 3.0 V to 3.6 V supply range compatible with standard 3 V SDRAM systems.
- Interface Parallel memory interface suitable for designs that require synchronous parallel access to external DRAM.
- Package 90‑TFBGA (8×13) BGA package offering a compact footprint for board-level integration.
- Temperature Range Commercial operating temperature range of 0 °C to 70 °C (TA).
Typical Applications
- Embedded systems Provides volatile working memory for devices that require parallel SDRAM buffering and program data storage.
- Consumer electronics Suited for products needing off-chip SDRAM for temporary data storage and frame buffering.
- Networking and communications Can be used for packet buffering or temporary data queues in systems employing parallel memory interfaces.
Unique Advantages
- Wide 32‑bit organization: The 4M × 32 memory layout supports broad data paths, reducing the number of cycles required for wide-word transfers.
- High-clock operation: 166 MHz clock frequency combined with 5.4 ns access time enables responsive memory access for performance-sensitive tasks.
- Standard 3 V supply compatibility: 3.0–3.6 V operating range aligns with common system power rails for straightforward integration.
- Compact BGA package: 90‑TFBGA (8×13) package minimizes board area while providing the necessary pinout for parallel SDRAM connections.
- Commercial temperature suitability: Rated for 0 °C to 70 °C operation for general-purpose and consumer-grade applications.
Why Choose IS42S32400F-6BL?
The IS42S32400F-6BL delivers a focused combination of capacity, parallel 32‑bit organization, and synchronous DRAM performance in a compact 90‑TFBGA package. Its 166 MHz clock capability and 5.4 ns access time make it appropriate for designs that require deterministic, high-throughput volatile memory with standard 3 V power support.
This device is well suited to designers and procurement teams building commercial-level embedded systems, consumer electronics, and networking equipment that need reliable off-chip SDRAM for buffering and working storage while maintaining a small PCB footprint.
Request a quote or contact sales to discuss availability, pricing, and volume options for the IS42S32400F-6BL.