IS42S32400F-6TL-TR

IC DRAM 128MBIT PAR 86TSOP II
Part Description

IC DRAM 128MBIT PAR 86TSOP II

Quantity 1,848 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS42S32400F-6TL-TR – IC DRAM 128MBIT PAR 86TSOP II

The IS42S32400F-6TL-TR is a 128 Mbit volatile SDRAM organized as 4M × 32 and implemented with a parallel memory interface. It provides high-speed memory access with a specified clock frequency of 166 MHz and an access time of 5.4 ns, supplied from 3.0 V to 3.6 V and housed in an 86-TSOP II package (86-TFSOP, 0.400" / 10.16 mm width).

Suited for designs that require compact parallel SDRAM in a standard TSOP II footprint, the device offers a clear specification set for system integration within an ambient operating range of 0°C to 70°C.

Key Features

  • Memory Core — 128 Mbit volatile SDRAM organized as 4M × 32 for parallel data storage and access.
  • Performance — Supports a clock frequency of 166 MHz with a specified access time of 5.4 ns, providing defined timing characteristics for system design.
  • Interface — Parallel memory interface suitable for systems requiring synchronous DRAM connectivity.
  • Power — Operates from a 3.0 V to 3.6 V supply range, enabling compatibility with common 3 V system rails.
  • Package — Supplied in an 86-TSOP II (86-TFSOP) package, 0.400" (10.16 mm) width, for compact PCB mounting.
  • Environmental — Specified operating ambient temperature range of 0°C to 70°C (TA).

Typical Applications

  • Parallel memory expansion — Use where a 128 Mbit parallel SDRAM is required for temporary data storage in system memory architectures.
  • Embedded platforms — Fits compact PCB layouts that require a TSOP II packaged SDRAM device with defined timing and voltage specifications.
  • Data buffering — Applied in designs that need volatile high-speed memory for transient data handling within the specified clock and access time parameters.

Unique Advantages

  • Defined high-speed timing: The 166 MHz clock frequency and 5.4 ns access time provide clear performance targets for system timing and validation.
  • Standard memory organization: 4M × 32 configuration simplifies integration into existing 32-bit parallel memory buses.
  • Compact TSOP II footprint: 86-TSOP II (86-TFSOP, 10.16 mm width) package helps minimize PCB area while maintaining a standard form factor.
  • Flexible supply range: 3.0 V to 3.6 V operation supports common 3 V system power rails without additional voltage conversion.
  • Clear operating range: Specified 0°C to 70°C ambient rating simplifies thermal planning for commercial-grade applications.

Why Choose IS42S32400F-6TL-TR?

The IS42S32400F-6TL-TR positions itself as a clearly specified 128 Mbit parallel SDRAM option for designs that require deterministic timing, a compact TSOP II package, and standard 3 V supply operation. Its documented clock frequency, access time, organization, and package dimensions enable straightforward integration and verification into systems with parallel memory buses.

This device is suitable for engineers and procurement teams looking for a defined volatile SDRAM component for commercial-temperature applications where form factor, supply compatibility, and timing specifications drive component selection.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the IS42S32400F-6TL-TR.

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