IS42S32400F-6TLI-TR
| Part Description |
IC DRAM 128MBIT PAR 86TSOP II |
|---|---|
| Quantity | 680 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S32400F-6TLI-TR – 128 Mbit SDRAM, 86‑TSOP II
The IS42S32400F-6TLI-TR is a 128 Mbit volatile DRAM organized as 4M × 32 using SDRAM technology. It provides parallel memory interface operation with a 166 MHz clock capability and a 5.4 ns access time.
Designed for designs that require compact board-level memory, the device is supplied in an 86‑TSOP II (0.400", 10.16 mm width) package and supports a 3.0 V to 3.6 V supply range and an operating temperature range of −40 °C to 85 °C. Manufacturer: ISSI, Integrated Silicon Solution Inc.
Key Features
- Memory Core 128 Mbit SDRAM organized as 4M × 32 for 32‑bit wide parallel data paths.
- Performance Supports a 166 MHz clock frequency with an access time of 5.4 ns for responsive read/write operations.
- Interface Parallel memory interface compatible with standard SDRAM timing and control schemes.
- Power Operates from a 3.0 V to 3.6 V supply range to match common 3 V system rails.
- Package 86‑TSOP II package (0.400", 10.16 mm width) for compact PCB footprint and board-level mounting.
- Temperature Range Rated for operation from −40 °C to 85 °C (TA) for use in temperature‑varied environments.
Typical Applications
- System Memory for Parallel‑Bus Designs Provides temporary data storage in systems that require a 32‑bit parallel SDRAM interface.
- Frame Buffer and Graphics Memory 4M × 32 organization supports wide‑bus buffering for display or pixel data storage.
- Industrial and Embedded Equipment Suitable where a compact TSOP II package and −40 °C to 85 °C operating range are required.
Unique Advantages
- 32‑bit Wide Organization: 4M × 32 layout enables wider data paths to reduce transaction counts for parallel systems.
- High Clock Rate: 166 MHz clock capability supports higher throughput for time‑sensitive memory operations.
- Fast Access Time: 5.4 ns access time contributes to lower latency in read/write cycles.
- Wide Operating Voltage: 3.0 V to 3.6 V supply compatibility with standard 3 V system rails simplifies power sequencing.
- Compact TSOP II Package: 86‑TSOP II (0.400", 10.16 mm) balances density and ease of PCB placement for space‑constrained designs.
- Extended Temperature Capability: −40 °C to 85 °C rating supports deployment in thermally demanding environments.
Why Choose IS42S32400F-6TLI-TR?
The IS42S32400F-6TLI-TR positions itself as a practical SDRAM option for designs that demand a 128 Mbit parallel memory solution with a 32‑bit data path, high clock capability, and fast access performance. Its compact 86‑TSOP II package and support for a 3.0 V–3.6 V supply make it suitable for board‑level integration where footprint and standard power rails matter.
Engineers specifying this ISSI device benefit from a component that aligns measurable specs—clock frequency, access time, voltage range, and operating temperature—with system requirements for reliable, mid‑density volatile memory in embedded and industrial applications.
Request a quote or contact sales to discuss pricing and availability for the IS42S32400F-6TLI-TR.
