IS42S32400F-7B
| Part Description |
IC DRAM 128MBIT PAR 90TFBGA |
|---|---|
| Quantity | 1,564 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS42S32400F-7B – 128 Mbit SDRAM, Parallel Interface, 90-TFBGA
The IS42S32400F-7B is a 128 Mbit volatile SDRAM device organized as 4M × 32 with a parallel memory interface. It provides a single-package memory solution in a 90-TFBGA (8 × 13) footprint for surface-mount applications.
Designed for systems that require parallel SDRAM capacity and defined timing, the device operates at a clock frequency of 143 MHz and supports a supply voltage range of 3.0 V to 3.6 V with an operating ambient temperature range of 0°C to 70°C.
Key Features
- Memory Core – SDRAM Volatile SDRAM technology organized as 4M × 32 delivering 128 Mbit of memory capacity.
- Performance Specified clock frequency of 143 MHz for timing and system integration.
- Interface Parallel memory interface for direct connection to parallel memory buses and controllers.
- Power Supply voltage range from 3.0 V to 3.6 V to match standard 3 V SDRAM supply rails.
- Package 90-TFBGA (8 × 13) BGA package providing a compact surface-mount footprint.
- Operating Range Commercial ambient temperature rating of 0°C to 70°C (TA).
Typical Applications
- Parallel memory subsystems Use as 128 Mbit parallel SDRAM where organized 4M × 32 memory is required.
- Buffering and working memory Suitable for designs that require a defined 143 MHz SDRAM clock for data buffering and temporary storage.
- Compact surface-mount designs 90-TFBGA (8 × 13) package for applications needing a space-efficient BGA footprint.
Unique Advantages
- 128 Mbit density: Single-device 4M × 32 organization simplifies board-level memory capacity planning.
- Defined timing: 143 MHz clock frequency provides predictable timing for memory scheduling and integration.
- 3 V supply compatibility: 3.0 V to 3.6 V operating range aligns with common 3 V SDRAM power rails.
- Compact BGA footprint: 90-TFBGA (8 × 13) package enables space-efficient surface-mount placement.
- Commercial temperature rating: Specified 0°C to 70°C operating ambient range for standard commercial deployments.
Why Choose IC DRAM 128MBIT PAR 90TFBGA?
The IS42S32400F-7B combines a 128 Mbit SDRAM capacity with a parallel interface and a compact 90-TFBGA package, offering a straightforward memory option for designs that require defined timing and a 32-bit data organization. Its 143 MHz clock specification, 3.0 V to 3.6 V supply range, and 0°C to 70°C operating range provide clear, verifiable parameters for system integration.
This device is suited to engineers and procurement teams specifying parallel SDRAM in board-level designs where a known-density, known-timing memory component in a compact BGA footprint is required.
Request a quote or submit a sales inquiry to get pricing and availability for the IS42S32400F-7B.
