IS42S83200G-7BLI

IC DRAM 256MBIT PAR 54TFBGA
Part Description

IC DRAM 256MBIT PAR 54TFBGA

Quantity 635 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS42S83200G-7BLI – IC DRAM 256MBIT PAR 54TFBGA

The IS42S83200G-7BLI is a 256 Mbit synchronous DRAM (SDRAM) organized as 32M × 8 with four internal banks and a pipeline architecture for high-speed data transfer. It provides a parallel SDRAM interface with programmable burst modes and timing options for use in systems requiring synchronized, high-throughput memory access.

Key attributes include a 143 MHz clock frequency rating (‑7 speed grade), programmable CAS latency, and support for auto- and self-refresh modes, making it suitable for embedded and system memory buffering applications that demand predictable synchronous operation.

Key Features

  • Memory Core & Organization  256 Mbit SDRAM organized as 32M × 8 with four internal banks to support efficient row/column operations and bank interleaving.
  • Synchronous Pipeline Architecture  Fully synchronous design with all signals referenced to the rising edge of the clock to enable deterministic timing and pipeline data transfer.
  • Speed Grades & Timing  Clock frequency up to 143 MHz for the -7 grade with access times as low as 5.4 ns and programmable CAS latency (2 or 3 clocks).
  • Burst Control  Programmable burst length (1, 2, 4, 8, full page) and selectable burst sequence (sequential or interleave) for flexible read/write transfer patterns.
  • Refresh & Retention  Supports auto refresh (CBR) and self refresh; refresh count options include 8K cycles every 32 ms (A2 grade) or 64 ms (commercial/industrial/A1 grade).
  • Interface & Logic Levels  LVTTL-compatible interface with parallel memory access signals for integration with standard SDRAM controllers.
  • Power  Single power supply: 3.3 V ± 0.3 V (specified supply range 3.0 V to 3.6 V).
  • Package & Temperature  Supplied in a 54-ball TFBGA (8 × 8) package with an operating ambient temperature range of -40°C to +85°C.

Typical Applications

  • High-speed buffering  Used where pipeline SDRAM buffering is required to support sustained parallel data transfers and burst operations.
  • System memory expansion  Suitable for designs needing a 256 Mbit parallel SDRAM device with configurable burst and timing behavior for controller-managed memory.
  • Embedded controllers and FPGA memory  Employed as external synchronous memory for embedded systems or FPGA-based platforms that utilize parallel SDRAM interfaces.

Unique Advantages

  • Deterministic synchronous operation: Fully synchronous inputs and outputs referenced to the clock simplify timing analysis and controller integration.
  • Flexible performance tuning: Programmable CAS latency (2 or 3) and multiple burst lengths/sequences let designers optimize latency and throughput for application needs.
  • Robust refresh options: Auto and self-refresh support plus selectable refresh rates (8K cycles/32 ms or 64 ms) provide adaptability across grades and power profiles.
  • Industry-standard voltage: Operates from 3.0 V to 3.6 V (nominal 3.3 V), matching common system power rails.
  • Compact BGA package: 54-ball TFBGA (8×8) offers a small-footprint surface-mount solution for space-constrained PCB designs.
  • Wide operating temperature: Specified for -40°C to +85°C ambient operation for use in temperature-variable environments.

Why Choose IS42S83200G-7BLI?

The IS42S83200G-7BLI delivers a balanced combination of synchronous pipeline architecture, flexible burst control, and selectable timing that suits designs requiring predictable parallel SDRAM performance. Its 32M × 8 organization, programmable CAS latencies, and refresh modes allow system architects to tune memory behavior to specific throughput and power trade-offs.

This device is appropriate for engineers implementing external SDRAM in embedded systems, controllers, or FPGA platforms who need compact packaging, standard 3.3 V operation, and an industrial temperature range. The IS42S83200G-7BLI provides verifiable, datasheet-defined characteristics for reliable integration into long-term designs.

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