IS42S86400D-6TL
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 186 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S86400D-6TL – IC DRAM 512Mbit PAR 54TSOP II
The IS42S86400D-6TL is a 512 Mbit synchronous DRAM device organized as 64M × 8 with a parallel memory interface. It implements a fully synchronous, pipelined architecture with internal banking to support high-speed burst transfers and predictable timing for systems that require parallel SDRAM storage.
Designed for commercial-temperature applications, this device targets embedded and system designs that require expandable, low-latency volatile memory in a compact 54-pin TSOP-II package.
Key Features
- Memory Organization: 512 Mbit arranged as 64M × 8, providing a parallel x8 data path for standard SDRAM interfacing.
- SDRAM Core: Fully synchronous SDRAM with internal banks and pipeline architecture to support burst read/write operations and predictable timing referenced to the rising clock edge.
- Performance: Clock frequency up to 166 MHz (part -6); access time listed at 5.4 ns for the -6 speed grade, supporting low-latency memory access.
- Programmable Burst & Timing: Programmable burst lengths (1, 2, 4, 8, full page) and burst sequence (sequential/interleave); programmable CAS latency of 2 or 3 clocks for timing flexibility.
- Refresh & Self-Management: Auto Refresh and Self Refresh support with 8K refresh cycles per 64 ms, enabling reliable dynamic data retention.
- Interface & I/O: LVTTL-compatible interface and parallel memory signaling for compatibility with standard SDRAM controllers.
- Power: Supply voltage range specified as 3.0 V to 3.6 V for this part number.
- Package: 54-pin TSOP-II (0.400", 10.16 mm width) — compact surface-mount package for space-constrained PCBs.
- Operating Temperature: Commercial temperature range of 0°C to +70°C (TA).
Typical Applications
- Embedded Systems: Expand volatile system memory where parallel SDRAM is required for code or data buffering in embedded controllers.
- Consumer Electronics: Use as system DRAM in devices that employ parallel memory interfaces and require compact package options.
- Networking & Communications Equipment: Buffering and packet storage in designs that need predictable SDRAM timing and burst transfers.
Unique Advantages
- Flexible Timing Configuration: Programmable CAS latency and multiple burst length options let designers tune performance to system timing requirements.
- High-Speed Parallel Access: 166 MHz clock rating and 5.4 ns access time (‑6 speed grade) enable responsive memory transactions for latency-sensitive tasks.
- Compact, Standard Package: 54-pin TSOP-II minimizes board area while providing a standard footprint for parallel SDRAM integration.
- Robust Refresh Mechanisms: Auto Refresh and Self Refresh with defined refresh cycles (8K/64 ms) reduce the burden on system refresh management.
- LVTTL Interface Compatibility: Standard LVTTL signaling simplifies interfacing with common SDRAM controllers and logic families.
Why Choose IS42S86400D-6TL?
The IS42S86400D-6TL offers a balanced combination of performance, configurability, and compact packaging for designers needing a 512 Mbit parallel SDRAM solution. Its fully synchronous architecture, programmable timing options, and support for burst operations make it a practical choice for embedded and system-level memory expansion where predictable latency and efficient burst transfers are important.
This device is suitable for commercial-temperature designs that require a 3.0–3.6 V supply and a standard 54-pin TSOP-II footprint, providing straightforward integration into existing parallel SDRAM memory architectures.
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