IS42S86400D-6TL

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 186 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS42S86400D-6TL – IC DRAM 512Mbit PAR 54TSOP II

The IS42S86400D-6TL is a 512 Mbit synchronous DRAM device organized as 64M × 8 with a parallel memory interface. It implements a fully synchronous, pipelined architecture with internal banking to support high-speed burst transfers and predictable timing for systems that require parallel SDRAM storage.

Designed for commercial-temperature applications, this device targets embedded and system designs that require expandable, low-latency volatile memory in a compact 54-pin TSOP-II package.

Key Features

  • Memory Organization: 512 Mbit arranged as 64M × 8, providing a parallel x8 data path for standard SDRAM interfacing.
  • SDRAM Core: Fully synchronous SDRAM with internal banks and pipeline architecture to support burst read/write operations and predictable timing referenced to the rising clock edge.
  • Performance: Clock frequency up to 166 MHz (part -6); access time listed at 5.4 ns for the -6 speed grade, supporting low-latency memory access.
  • Programmable Burst & Timing: Programmable burst lengths (1, 2, 4, 8, full page) and burst sequence (sequential/interleave); programmable CAS latency of 2 or 3 clocks for timing flexibility.
  • Refresh & Self-Management: Auto Refresh and Self Refresh support with 8K refresh cycles per 64 ms, enabling reliable dynamic data retention.
  • Interface & I/O: LVTTL-compatible interface and parallel memory signaling for compatibility with standard SDRAM controllers.
  • Power: Supply voltage range specified as 3.0 V to 3.6 V for this part number.
  • Package: 54-pin TSOP-II (0.400", 10.16 mm width) — compact surface-mount package for space-constrained PCBs.
  • Operating Temperature: Commercial temperature range of 0°C to +70°C (TA).

Typical Applications

  • Embedded Systems: Expand volatile system memory where parallel SDRAM is required for code or data buffering in embedded controllers.
  • Consumer Electronics: Use as system DRAM in devices that employ parallel memory interfaces and require compact package options.
  • Networking & Communications Equipment: Buffering and packet storage in designs that need predictable SDRAM timing and burst transfers.

Unique Advantages

  • Flexible Timing Configuration: Programmable CAS latency and multiple burst length options let designers tune performance to system timing requirements.
  • High-Speed Parallel Access: 166 MHz clock rating and 5.4 ns access time (‑6 speed grade) enable responsive memory transactions for latency-sensitive tasks.
  • Compact, Standard Package: 54-pin TSOP-II minimizes board area while providing a standard footprint for parallel SDRAM integration.
  • Robust Refresh Mechanisms: Auto Refresh and Self Refresh with defined refresh cycles (8K/64 ms) reduce the burden on system refresh management.
  • LVTTL Interface Compatibility: Standard LVTTL signaling simplifies interfacing with common SDRAM controllers and logic families.

Why Choose IS42S86400D-6TL?

The IS42S86400D-6TL offers a balanced combination of performance, configurability, and compact packaging for designers needing a 512 Mbit parallel SDRAM solution. Its fully synchronous architecture, programmable timing options, and support for burst operations make it a practical choice for embedded and system-level memory expansion where predictable latency and efficient burst transfers are important.

This device is suitable for commercial-temperature designs that require a 3.0–3.6 V supply and a standard 54-pin TSOP-II footprint, providing straightforward integration into existing parallel SDRAM memory architectures.

Request a quote or contact sales for pricing, lead time, and availability for IS42S86400D-6TL.

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