IS42S86400D-6TLI

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 100 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS42S86400D-6TLI – IC DRAM 512MBIT PAR 54TSOP II

The IS42S86400D-6TLI is a 512 Mbit synchronous DRAM organized as 64M × 8 using a fully synchronous, pipelined architecture. It provides parallel SDRAM memory with programmable burst length and CAS latency for systems that require deterministic, clocked memory access.

Key attributes include a 166 MHz clock rating, 5.4 ns access time (CL-dependent), a 54-pin TSOP-II package, a parallel memory interface, a 3.0–3.6 V supply range, and an operating temperature range of −40°C to +85°C.

Key Features

  • Core & architecture  Fully synchronous SDRAM with internal banks and pipeline architecture; all signals referenced to the rising edge of the clock.
  • Memory capacity & organization  512 Mbit density configured as 64M × 8 across four internal banks.
  • Performance  166 MHz clock frequency (–6 speed grade) with access time from clock as low as 5.4 ns (CAS-latency dependent).
  • Programmability  Programmable burst length (1, 2, 4, 8, full page) and selectable burst sequence (sequential/interleave); programmable CAS latency (2 or 3 clocks).
  • Refresh & reliability  Auto Refresh and Self Refresh support with 8K refresh cycles per 64 ms (standard refresh operation documented).
  • Interface  Parallel memory interface with LVTTL-compatible signaling and random column access every clock cycle.
  • Power  Supply voltage range listed as 3.0 V to 3.6 V for this device variant.
  • Package & thermal  54-pin TSOP-II (0.400" / 10.16 mm width) in a compact surface-mount footprint; operating temperature −40°C to +85°C (TA).

Typical Applications

  • High-speed system memory  Provides 512 Mbit of parallel SDRAM capacity for designs that require synchronous, clocked memory access.
  • Industrial equipment  Suitable for systems needing operation across −40°C to +85°C, where a parallel SDRAM interface and TSOP-II footprint are required.
  • Legacy/parallel-interface designs  Fits applications and boards designed around 54-pin TSOP-II parallel SDRAM packages and LVTTL signaling.

Unique Advantages

  • Deterministic synchronous operation: Programmable CAS latency and burst controls enable predictable, clock-referenced data transfers.
  • Flexible burst and access modes: Support for multiple burst lengths and sequential/interleave burst sequences simplifies memory controller tuning for throughput or latency.
  • Industrial temperature support: Rated for −40°C to +85°C, enabling use in temperature-challenging environments.
  • Compact TSOP-II package: 54-pin TSOP-II package provides a small-footprint solution for PCB designs constrained by board area.
  • Standard supply range: Operates from 3.0 V to 3.6 V, matching common 3.3 V system power rails.
  • Documented vendor specification: Device functions and timing parameters are specified in the manufacturer datasheet for design validation.

Why Choose IS42S86400D-6TLI?

The IS42S86400D-6TLI combines 512 Mbit density, a fully synchronous pipelined architecture, and programmable latency/burst features to deliver a predictable parallel SDRAM solution for systems that demand clock-referenced memory access. Its 54-pin TSOP-II package and support for −40°C to +85°C operation make it practical for board-level designs where compact footprint and extended temperature range are important.

This device is suited for engineers specifying parallel SDRAM in applications that require documented timing, programmable access modes, and a standard 3.0–3.6 V supply. Detailed electrical and timing specifications are provided in the manufacturer documentation to support integration and validation in the design cycle.

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