IS42S86400D-6TLI
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 100 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S86400D-6TLI – IC DRAM 512MBIT PAR 54TSOP II
The IS42S86400D-6TLI is a 512 Mbit synchronous DRAM organized as 64M × 8 using a fully synchronous, pipelined architecture. It provides parallel SDRAM memory with programmable burst length and CAS latency for systems that require deterministic, clocked memory access.
Key attributes include a 166 MHz clock rating, 5.4 ns access time (CL-dependent), a 54-pin TSOP-II package, a parallel memory interface, a 3.0–3.6 V supply range, and an operating temperature range of −40°C to +85°C.
Key Features
- Core & architecture Fully synchronous SDRAM with internal banks and pipeline architecture; all signals referenced to the rising edge of the clock.
- Memory capacity & organization 512 Mbit density configured as 64M × 8 across four internal banks.
- Performance 166 MHz clock frequency (–6 speed grade) with access time from clock as low as 5.4 ns (CAS-latency dependent).
- Programmability Programmable burst length (1, 2, 4, 8, full page) and selectable burst sequence (sequential/interleave); programmable CAS latency (2 or 3 clocks).
- Refresh & reliability Auto Refresh and Self Refresh support with 8K refresh cycles per 64 ms (standard refresh operation documented).
- Interface Parallel memory interface with LVTTL-compatible signaling and random column access every clock cycle.
- Power Supply voltage range listed as 3.0 V to 3.6 V for this device variant.
- Package & thermal 54-pin TSOP-II (0.400" / 10.16 mm width) in a compact surface-mount footprint; operating temperature −40°C to +85°C (TA).
Typical Applications
- High-speed system memory Provides 512 Mbit of parallel SDRAM capacity for designs that require synchronous, clocked memory access.
- Industrial equipment Suitable for systems needing operation across −40°C to +85°C, where a parallel SDRAM interface and TSOP-II footprint are required.
- Legacy/parallel-interface designs Fits applications and boards designed around 54-pin TSOP-II parallel SDRAM packages and LVTTL signaling.
Unique Advantages
- Deterministic synchronous operation: Programmable CAS latency and burst controls enable predictable, clock-referenced data transfers.
- Flexible burst and access modes: Support for multiple burst lengths and sequential/interleave burst sequences simplifies memory controller tuning for throughput or latency.
- Industrial temperature support: Rated for −40°C to +85°C, enabling use in temperature-challenging environments.
- Compact TSOP-II package: 54-pin TSOP-II package provides a small-footprint solution for PCB designs constrained by board area.
- Standard supply range: Operates from 3.0 V to 3.6 V, matching common 3.3 V system power rails.
- Documented vendor specification: Device functions and timing parameters are specified in the manufacturer datasheet for design validation.
Why Choose IS42S86400D-6TLI?
The IS42S86400D-6TLI combines 512 Mbit density, a fully synchronous pipelined architecture, and programmable latency/burst features to deliver a predictable parallel SDRAM solution for systems that demand clock-referenced memory access. Its 54-pin TSOP-II package and support for −40°C to +85°C operation make it practical for board-level designs where compact footprint and extended temperature range are important.
This device is suited for engineers specifying parallel SDRAM in applications that require documented timing, programmable access modes, and a standard 3.0–3.6 V supply. Detailed electrical and timing specifications are provided in the manufacturer documentation to support integration and validation in the design cycle.
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