IS42S86400D-7TL-TR
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,910 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S86400D-7TL-TR – IC DRAM 512Mbit Parallel 54-TSOP II
The IS42S86400D-7TL-TR is a 512Mbit synchronous DRAM organized as 64M × 8 with a parallel memory interface in a 54-pin TSOP II package. It implements a fully synchronous, pipelined architecture with internal bank management to support high-speed data transfers.
Designed for systems requiring fast, low-latency parallel DRAM, this device offers a 143 MHz clock option (–7 timing grade), 5.4 ns access time, programmable burst modes and CAS latency, and operation from a 3.0 V to 3.6 V supply within a 0 °C to 70 °C ambient range.
Key Features
- Core / Architecture Fully synchronous SDRAM with pipeline architecture and internal banks to hide row access and precharge latency.
- Memory Organization & Capacity 512 Mbit total organized as 64M × 8 with 4 internal banks.
- Performance & Timing –7 timing grade supports a 143 MHz clock frequency with an access time from clock of 5.4 ns and programmable CAS latency (2 or 3 clocks).
- Burst & Access Modes Programmable burst length (1, 2, 4, 8, full page) and selectable burst sequence (sequential/interleave); supports burst read/write and burst read/single write operations.
- Refresh & Power Management Auto Refresh (CBR) and Self Refresh supported with 8K refresh cycles every 64 ms.
- Interface Parallel memory interface with LVTTL signaling.
- Power Supply range specified as 3.0 V to 3.6 V for this device variant.
- Package & Mounting 54-pin TSOP II (0.400", 10.16 mm width) surface-mount package.
- Operating Range Commercial temperature grade: 0 °C to +70 °C (TA).
Typical Applications
- Parallel memory subsystems Used as high-speed synchronous DRAM in systems that require a 512 Mbit parallel memory device with LVTTL interface.
- Embedded memory expansion Suitable for designs needing a 64M × 8 memory organization with programmable burst and CAS latency options for flexible timing.
- High-throughput buffering Applicable where synchronous, pipelined DRAM with internal bank management and auto/self-refresh is required to support continuous data transfer.
Unique Advantages
- Deterministic timing options: The –7 timing grade provides 143 MHz operation and 5.4 ns access time, enabling predictable performance for timing-sensitive designs.
- Flexible burst control: Programmable burst lengths and sequence modes simplify data transfer patterns and system memory controller integration.
- Integrated refresh management: Auto Refresh and Self Refresh with 8K cycles per 64 ms reduce external refresh overhead and simplify maintenance of data integrity.
- Standard TSOP II package: 54-pin TSOP II footprint (10.16 mm width) provides a compact, industry-standard mounting option for surface-mount assemblies.
- LVTTL signaling compatibility: Parallel LVTTL interface supports straightforward interfacing to compatible memory controllers and logic.
- Wide supply tolerance: Operates across a 3.0 V to 3.6 V supply range to accommodate typical 3.3 V system rails.
Why Choose IC DRAM 512Mbit PAR 54TSOP II?
The IS42S86400D-7TL-TR positions itself as a practical, specification-driven choice for designs that require a 512 Mbit synchronous DRAM with parallel interface and compact TSOP II packaging. Its combination of 143 MHz timing grade, programmable CAS and burst options, and built-in refresh features makes it suitable for systems that demand predictable, high-speed memory behavior.
This device is well suited for engineers and procurement teams targeting robust, commercially rated SDRAM for embedded and system-level memory applications where defined electrical and timing characteristics, compact package footprint, and LVTTL interfacing are required.
If you need pricing, lead-time or to request a quote for IS42S86400D-7TL-TR, submit a request for a quote or contact sales to obtain product availability and ordering information.