IS42S86400F-6TL

IC DRAM 512MBIT PAR 54TSOP II
Part Description

IC DRAM 512MBIT PAR 54TSOP II

Quantity 881 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size512 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS42S86400F-6TL – 512 Mbit SDRAM, 54‑TSOP II

The IS42S86400F-6TL is a 512 Mbit volatile SDRAM device organized as 64M × 8 with a parallel DRAM interface. It implements SDRAM architecture and is specified for operation from a 3.0 V to 3.6 V supply.

This device delivers a 166 MHz clock frequency and a 5.4 ns access time in a 54‑TSOP II (0.400", 10.16 mm width) package, and is specified for ambient operating temperatures from 0°C to 70°C (TA).

Key Features

  • Memory Architecture Organized as 64M × 8 to provide a total memory size of 512 Mbit in a parallel DRAM format.
  • SDRAM Technology Implements SDRAM parallel architecture for synchronous memory operation at the specified clock rate.
  • Performance Supports a clock frequency of 166 MHz with an access time of 5.4 ns.
  • Power Operates from a 3.0 V to 3.6 V supply range.
  • Interface Parallel memory interface suitable for direct integration into parallel memory buses.
  • Package Available in a 54‑TSOP II package (0.400", 10.16 mm width) intended for surface-mount PCB assembly.
  • Operating Temperature Specified for ambient temperatures from 0°C to 70°C (TA).

Typical Applications

  • Embedded Memory Expansion Use as 512 Mbit parallel SDRAM to expand system memory in embedded designs that support a parallel DRAM interface.
  • Consumer Electronics Memory Integration as system or buffer memory in consumer devices that operate within the 0°C to 70°C ambient range and require 3.0–3.6 V supply.
  • Digital Processing Modules Deploy as working memory for digital processing subsystems requiring synchronous parallel DRAM with 166 MHz clock capability.

Unique Advantages

  • Mid‑density 512 Mbit capacity: Provides substantial storage in a single-chip 64M × 8 organization for systems needing moderate memory density.
  • Synchronous parallel operation: SDRAM architecture with a 166 MHz clock enables synchronous memory transactions with a specified 5.4 ns access time.
  • Flexible supply range: 3.0 V to 3.6 V operation supports common 3.3 V system rails.
  • Compact TSOP II footprint: 54‑TSOP II package (10.16 mm width) eases PCB layout for surface-mount assembly while providing required pin count for parallel interface.
  • Specified operating range: Rated for ambient operation from 0°C to 70°C, aligning with a broad set of temperature-controlled consumer and embedded applications.

Why Choose IC DRAM 512MBIT PAR 54TSOP II?

The IS42S86400F-6TL is positioned for designs that require a mid-density, parallel SDRAM solution with defined timing and power characteristics. Its 64M × 8 organization, 166 MHz clock rating, and 5.4 ns access time provide deterministic SDRAM performance in a compact 54‑TSOP II package.

This device is appropriate for engineers and procurement teams specifying parallel DRAM memory that must operate from a 3.0–3.6 V supply and within an ambient range of 0°C to 70°C. It offers a clear, verifiable set of electrical and mechanical specifications for integration into systems needing 512 Mbit of volatile SDRAM.

Request a quote or submit an inquiry to evaluate IS42S86400F-6TL for your design requirements and obtain pricing and availability information.

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