IS42S86400F-6TL
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 881 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S86400F-6TL – 512 Mbit SDRAM, 54‑TSOP II
The IS42S86400F-6TL is a 512 Mbit volatile SDRAM device organized as 64M × 8 with a parallel DRAM interface. It implements SDRAM architecture and is specified for operation from a 3.0 V to 3.6 V supply.
This device delivers a 166 MHz clock frequency and a 5.4 ns access time in a 54‑TSOP II (0.400", 10.16 mm width) package, and is specified for ambient operating temperatures from 0°C to 70°C (TA).
Key Features
- Memory Architecture Organized as 64M × 8 to provide a total memory size of 512 Mbit in a parallel DRAM format.
- SDRAM Technology Implements SDRAM parallel architecture for synchronous memory operation at the specified clock rate.
- Performance Supports a clock frequency of 166 MHz with an access time of 5.4 ns.
- Power Operates from a 3.0 V to 3.6 V supply range.
- Interface Parallel memory interface suitable for direct integration into parallel memory buses.
- Package Available in a 54‑TSOP II package (0.400", 10.16 mm width) intended for surface-mount PCB assembly.
- Operating Temperature Specified for ambient temperatures from 0°C to 70°C (TA).
Typical Applications
- Embedded Memory Expansion Use as 512 Mbit parallel SDRAM to expand system memory in embedded designs that support a parallel DRAM interface.
- Consumer Electronics Memory Integration as system or buffer memory in consumer devices that operate within the 0°C to 70°C ambient range and require 3.0–3.6 V supply.
- Digital Processing Modules Deploy as working memory for digital processing subsystems requiring synchronous parallel DRAM with 166 MHz clock capability.
Unique Advantages
- Mid‑density 512 Mbit capacity: Provides substantial storage in a single-chip 64M × 8 organization for systems needing moderate memory density.
- Synchronous parallel operation: SDRAM architecture with a 166 MHz clock enables synchronous memory transactions with a specified 5.4 ns access time.
- Flexible supply range: 3.0 V to 3.6 V operation supports common 3.3 V system rails.
- Compact TSOP II footprint: 54‑TSOP II package (10.16 mm width) eases PCB layout for surface-mount assembly while providing required pin count for parallel interface.
- Specified operating range: Rated for ambient operation from 0°C to 70°C, aligning with a broad set of temperature-controlled consumer and embedded applications.
Why Choose IC DRAM 512MBIT PAR 54TSOP II?
The IS42S86400F-6TL is positioned for designs that require a mid-density, parallel SDRAM solution with defined timing and power characteristics. Its 64M × 8 organization, 166 MHz clock rating, and 5.4 ns access time provide deterministic SDRAM performance in a compact 54‑TSOP II package.
This device is appropriate for engineers and procurement teams specifying parallel DRAM memory that must operate from a 3.0–3.6 V supply and within an ambient range of 0°C to 70°C. It offers a clear, verifiable set of electrical and mechanical specifications for integration into systems needing 512 Mbit of volatile SDRAM.
Request a quote or submit an inquiry to evaluate IS42S86400F-6TL for your design requirements and obtain pricing and availability information.