IS42S86400D-7TLI
| Part Description |
IC DRAM 512MBIT PAR 54TSOP II |
|---|---|
| Quantity | 7 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS42S86400D-7TLI – IC DRAM 512MBIT PAR 54TSOP II
The IS42S86400D-7TLI is a 512 Mbit synchronous DRAM organized as 64M × 8, implementing a pipelined architecture for high-speed parallel memory access. It is a fully synchronous device with all signals referenced to the rising edge of the clock and is offered in a 54-pin TSOP-II package.
This device targets systems requiring a parallel SDRAM interface with programmable burst operation, selectable CAS latency, and standard refresh modes, operating from 3.0 V to 3.6 V and specified for −40°C to +85°C ambient.
Key Features
- Memory Type & Organization — 512 Mbit SDRAM organized as 64M × 8 with internal bank architecture (4 banks) for hidden row access/precharge and pipelined operation.
- Clock & Timing — Specified for a 143 MHz clock (–7 speed grade) with access time from clock as low as 5.4 ns and programmable CAS latency (2 or 3 clocks).
- Burst and Sequencing — Programmable burst length (1, 2, 4, 8, full page) and selectable burst sequence (Sequential or Interleave); supports burst read/write and burst read/single write operations with burst termination commands.
- Refresh & Self-Refresh — Auto refresh (CBR) and self-refresh supported with 8K refresh cycles every 64 ms (commercial/industrial) as specified.
- Interface & Logic Levels — LVTTL-compatible interface with random column addressing capability every clock cycle.
- Power — Operating supply range listed as 3.0 V to 3.6 V for this device variant.
- Package — 54-pin TSOP-II (0.400", 10.16 mm width) supply option for x8 devices.
- Operating Temperature — Specified ambient range −40°C to +85°C.
Unique Advantages
- Synchronous pipelined architecture: All I/O referenced to the rising clock edge supports deterministic timing and simplified system timing analysis.
- Flexible burst modes: Programmable burst lengths and sequences enable optimization of throughput for varied access patterns.
- Selectable CAS latency: CAS latency options (2 or 3) allow tuning between latency and clock-frequency targets.
- Standard refresh support: Auto and self-refresh modes with specified 8K/64 ms refresh cycles help maintain data integrity across operating conditions.
- Industrial temperature rating: Specified for −40°C to +85°C ambient to support deployments requiring extended temperature range.
- Compact TSOP-II package: 54-pin TSOP-II (10.16 mm width) provides a standard footprint for x8 SDRAM in space-constrained board designs.
Why Choose IS42S86400D-7TLI?
The IS42S86400D-7TLI offers a 512 Mbit, fully synchronous SDRAM solution with programmable burst control, selectable CAS latency, and standard refresh modes, delivering predictable high-speed parallel memory behavior. Its operating voltage range and industrial temperature rating make it suitable for designs that require stable SDRAM performance across a wide range of conditions.
This device is appropriate for engineers specifying parallel SDRAM with a 54-pin TSOP-II footprint who need configurable burst and timing options along with self-refresh and auto-refresh capabilities for reliable data retention. The combination of timing parameters, interface compatibility, and package availability supports straightforward integration into systems using parallel SDRAM memory.
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