IS43DR16160B-37CBLI-TR

The IS43DR16160B-37CBLI-TR is a 256 Mbit volatile DRAM device organized as 16M × 16 using DDR2 SDRAM technology with a parallel interface. It provides a 266 MHz clock frequency and is specified for operation from -40°C to 85°C, making it suitable for designs that require mid-density DDR2 memory in a compact BGA package.

This device targets applications that need synchronous DDR2 memory with defined timing characteristics and low-voltage supply operation, offering a compact footprint and industry-standard memory organization.

Key Features

• Memory Core 256 Mbit DDR2 SDRAM organized as 16M × 16, providing a parallel memory interface for synchronous data transfer.
• Performance 266 MHz clock frequency with an access time of 500 ps and a write cycle time (word page) of 15 ns.
• Power Operates from a 1.7 V to 1.9 V supply range, matching low-voltage DDR2 system requirements.
• Package Supplied in an 84-ball BGA package (listed as 84-TFBGA and 84-TWBGA with an 8 × 12.5 mm footprint), optimized for compact board layouts.
• Temperature Range Industrial operating temperature range of -40°C to 85°C (TA).
• Memory Interface Parallel DDR2 interface suitable for systems designed around synchronous DRAM signaling.

Typical Applications

• Embedded memory systems — Use as on-board DDR2 memory where a 256 Mbit, 16M × 16 organization is required for buffering or working memory.
• Industrial control equipment — Provides DDR2 memory capacity with an operating range of -40°C to 85°C for temperature-challenged environments.
• Compact board designs — The 84-ball BGA (8 × 12.5 mm) package supports space-constrained layouts that need DDR2 memory integration.

Unique Advantages

• Standard DDR2 interface: Parallel DDR2 SDRAM architecture with defined timing parameters for integration into synchronous memory subsystems.
• Defined performance metrics: 266 MHz clock frequency, 500 ps access time, and 15 ns write cycle time provide clear timing targets for system designers.
• Low-voltage operation: 1.7 V to 1.9 V supply range aligns with low-voltage DDR2 system designs.
• Compact BGA package: 84-ball BGA (84-TFBGA / 84-TWBGA 8×12.5) reduces PCB area for space-sensitive applications.
• Wide operating temperature: Rated for -40°C to 85°C to support deployment in a range of environmental conditions.
• Clear memory organization: 16M × 16 arrangement simplifies capacity planning and system memory mapping.

Why Choose IS43DR16160B-37CBLI-TR?

The IS43DR16160B-37CBLI-TR is positioned for designs that require a mid-density DDR2 SDRAM with explicit timing and voltage specifications, a compact BGA footprint, and an industrial temperature range. Its 16M × 16 organization and 256 Mbit capacity make it straightforward to integrate into systems needing parallel DDR2 memory.

Choose this device when you need verifiable DDR2 memory parameters, a low-voltage supply range, and a small-package form factor that supports constrained PCB real estate while maintaining a usable temperature range for many embedded and industrial applications.

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