IS43DR16160B-37CBLI

IC DRAM 256MBIT PAR 84TWBGA
Part Description

IC DRAM 256MBIT PAR 84TWBGA

Quantity 1,227 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package84-TWBGA (8x12.5)Memory FormatDRAMTechnologySDRAM - DDR2
Memory Size256 MbitAccess Time500 psGradeIndustrial
Clock Frequency266 MHzVoltage1.7V ~ 1.9VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging84-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of IS43DR16160B-37CBLI - 256Mbit DDR2 SDRAM

The IS43DR16160B-37CBLI is a 256-megabit DDR2 SDRAM organized as 16M x 16, designed for applications requiring high-speed data access and reliable volatile memory storage. Built on advanced SDRAM technology, this memory IC operates at 266MHz and provides a fast 0.5ns access time, making it suitable for embedded systems, consumer electronics, and industrial applications where performance and extended temperature tolerance are essential.

With an industrial temperature range of -40°C to 85°C and a compact 84-pin TWBGA package, this DDR2 SDRAM delivers dependable memory performance in space-constrained designs operating in demanding thermal environments.

Key Features

  • Memory Architecture - 256Mbit capacity organized as 16M words x 16 bits, providing flexible data access for embedded applications requiring moderate memory density.
  • DDR2 SDRAM Technology - Double data rate architecture with 266MHz clock frequency enables efficient data throughput with 15ns write cycle time, supporting responsive system performance.
  • Fast Access Performance - 0.5ns access time ensures low-latency memory operations for time-critical applications.
  • Extended Temperature Operation - Industrial temperature range of -40°C to 85°C (TA) guarantees reliable operation in harsh environments including automotive, industrial control, and outdoor equipment.
  • Low Voltage Operation - 1.7V to 1.9V supply voltage reduces power consumption and heat generation in battery-powered and thermally-sensitive designs.
  • Compact Package - 84-pin TWBGA (8mm x 12.5mm) footprint minimizes PCB space requirements while maintaining parallel interface connectivity.

Typical Applications

  • Industrial Control Systems - This DDR2 SDRAM serves as main memory in PLCs, motion controllers, and HMI systems where the extended temperature range ensures consistent operation in factory floor environments and the parallel interface simplifies integration with industrial microcontrollers.
  • Automotive Infotainment - The wide operating temperature tolerance makes this memory suitable for in-vehicle multimedia systems, navigation displays, and instrument clusters that must function reliably from cold starts to high-temperature cabin conditions.
  • Network Infrastructure Equipment - Routers, switches, and gateway devices benefit from the fast access time and DDR2 architecture for packet buffering and routing table storage in telecom and enterprise networking applications.
  • Medical Instrumentation - Diagnostic equipment and patient monitoring systems utilize this SDRAM for data acquisition and processing, where reliable performance across temperature variations is critical for accurate measurements.
  • Consumer Electronics - Set-top boxes, digital cameras, and portable media players leverage the 256Mbit capacity and low voltage operation for cost-effective memory solutions in power-sensitive designs.

Unique Advantages

  • Industrial-Grade Reliability: The -40°C to 85°C operating range eliminates the need for thermal management in many applications, reducing system complexity and BOM costs compared to commercial-grade memory requiring active cooling.
  • Optimized Density and Cost: 256Mbit capacity hits the sweet spot for embedded applications that have outgrown smaller memories but don't require higher-density (and more expensive) alternatives, delivering cost-effective scalability.
  • Parallel Interface Simplicity: Direct parallel connectivity reduces design complexity compared to serial memory interfaces, shortening development cycles and simplifying PCB routing for legacy system upgrades.
  • Proven DDR2 Technology: Mature DDR2 architecture ensures stable supply availability and broad ecosystem support with well-documented design practices, reducing qualification risk for long product lifecycles.
  • Space-Efficient Packaging: The compact 84-TWBGA footprint provides high pin density in a small form factor, enabling memory integration in size-constrained portable and embedded applications.
  • Low Power Consumption: The 1.7V to 1.9V operating voltage minimizes power draw and thermal dissipation, extending battery life in portable equipment and reducing cooling requirements in enclosed systems.

Why Choose IS43DR16160B-37CBLI?

The IS43DR16160B-37CBLI is engineered for designers who need dependable DDR2 memory with industrial-grade temperature tolerance and proven technology. ISSI's commitment to quality manufacturing ensures consistent performance for applications ranging from industrial automation to automotive systems where memory reliability directly impacts system uptime and safety.

For embedded system architects working on products with multi-year lifecycles, this SDRAM provides the right balance of capacity, performance, and environmental robustness. The parallel interface and mature DDR2 technology reduce integration complexity while the extended temperature range future-proofs designs against harsh operating conditions.

Get Started with IS43DR16160B-37CBLI

Ready to integrate reliable DDR2 memory into your next design? Contact our sales team to request a quote, discuss volume pricing, or receive technical guidance on optimizing this SDRAM for your specific application requirements.

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