IS43R16320D-6BL-TR
| Part Description |
IC DRAM 512MBIT PAR 60TFBGA |
|---|---|
| Quantity | 787 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 60-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS43R16320D-6BL-TR – IC DRAM 512Mbit PAR 60TFBGA
The IS43R16320D-6BL-TR is a 512Mbit DDR SDRAM organized as 32M × 16 that implements a double-data-rate pipeline architecture for high-speed data transfers. It provides a parallel memory interface with SSTL_2 compatible I/O and on-die features for burst access and programmable timing.
Designed for commercial-temperature systems, this device targets applications requiring high-throughput, low-latency DRAM in a compact 60-TFBGA (8×13) package, with supply operation across 2.3 V to 2.7 V.
Key Features
- Memory Core & Organization 512 Mbit DDR SDRAM organized as 32M × 16 with four internal banks to support concurrent operations.
- Double-Data-Rate Architecture Two data transfers per clock cycle with bidirectional data strobe (DQS) for capture on both edges; DQS is edge-aligned for READs and center-aligned for WRITEs.
- Clocking & DLL Differential clock inputs (CK/CK̄) and an internal DLL to align DQ and DQS transitions with clock transitions. Commands are registered on the positive CK edge.
- Performance & Timing Clock frequency up to 166 MHz (specified), access time 700 ps, programmable CAS latency options (2, 2.5, 3), and write cycle time (word/Page) of 15 ns.
- Burst and Masking Burst lengths of 2, 4 and 8 with sequential and interleave burst types; Data Mask (DM) supports masking on both edges of the data strobe.
- Refresh & Power Modes Supports Auto Refresh and Self Refresh modes plus Auto Precharge; TRAS lockout supported (tRAP = tRCD).
- Electrical Supply voltage range 2.3 V to 2.7 V; I/O compatible with SSTL_2 signaling.
- Package & Temperature 60-TFBGA (8×13) package; commercial operating temperature range 0°C to +70°C (TA).
Typical Applications
- Commercial embedded systems High-throughput working memory where compact DDR SDRAM is required within a commercial temperature envelope.
- High-speed data buffering Temporary data storage and burst transfers in systems that leverage DDR parallel memory interfaces and SSTL_2 I/O.
- System memory for controllers External DRAM for processors or controllers that support parallel DDR SDRAM and require programmable CAS latency and burst control.
Unique Advantages
- Double-data-rate throughput: Enables two data transfers per clock cycle for increased effective bandwidth without changing clock rate.
- Flexible timing and burst control: Programmable CAS latency and selectable burst lengths (2/4/8) allow tuning for latency and bandwidth trade-offs.
- SSTL_2 compatible I/O and differential clocking: Ensures signal integrity with industry-standard SSTL_2 signaling and differential CK/CK̄ inputs.
- Integrated DLL and DQS alignment: On-die DLL and DQS timing alignment simplify meeting setup/hold requirements for high-speed read/write operations.
- Compact BGA package: 60-TFBGA (8×13) provides a small footprint for space-constrained board designs.
- Commercial temperature rating: Specified for 0°C to +70°C, suitable for a broad set of commercial applications.
Why Choose IS43R16320D-6BL-TR?
The IS43R16320D-6BL-TR combines DDR SDRAM performance features—double-data-rate transfers, programmable CAS latency, burst modes, and on-die DLL—with SSTL_2 compatible I/O in a compact 60-ball TFBGA package. Its 32M × 16 organization and four-bank architecture support concurrent operations and efficient burst transfers for systems that need reliable commercial-grade parallel DDR memory.
This device is well suited for designers seeking a verified 512Mbit DDR SDRAM building block that balances throughput, configurability, and compact packaging for commercial electronic systems. Its supported refresh and power modes also help manage data integrity and power behavior in typical operational environments.
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