IS43R16800E-6TLI

IC DRAM 128MBIT PAR 66TSOP II
Part Description

IC DRAM 128MBIT PAR 66TSOP II

Quantity 93 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size128 MbitAccess Time700 psGradeIndustrial
Clock Frequency166 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page12 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS43R16800E-6TLI – IC DRAM 128MBIT PAR 66TSOP II

The IS43R16800E-6TLI is a 128 Mbit parallel DRAM device implemented as DDR SDRAM with an 8M × 16 memory organization. It delivers synchronous, parallel memory storage intended for systems that require a compact, mid-density DRAM solution operating over a broad temperature range.

Key Features

  • Memory Core 128 Mbit DRAM organized as 8M × 16, providing a standard parallel memory array for system buffering and temporary storage.
  • Technology & Performance DDR SDRAM technology with a clock frequency rating of 166 MHz and access time of 700 ps for synchronous data transactions.
  • Timing Write cycle time (word/page) specified at 12 ns, enabling deterministic write timing for parallel memory operations.
  • Power Operates from a 2.3 V to 2.7 V supply range, supporting low-voltage system designs.
  • Package Supplied in a 66-TSSOP / 66-TSOP II package (0.400", 10.16 mm width), suitable for PCB layouts requiring a compact TSOP footprint.
  • Temperature Range Rated for operation from −40 °C to 85 °C (TA), supporting a wide ambient temperature envelope for many embedded and industrial applications.

Typical Applications

  • Embedded Systems Use as parallel SDRAM memory in embedded designs that require a 128 Mbit DDR device with an 8M × 16 organization.
  • Industrial Electronics Suited to equipment operating across −40 °C to 85 °C where a compact TSOP memory package and low-voltage operation are required.
  • Systems with Parallel Memory Interfaces Fits designs that require synchronous parallel DRAM buffering or temporary storage with a 166 MHz clock rating and 12 ns write-cycle timing.

Unique Advantages

  • Compact TSOP II Package: The 66-TSSOP (66-TSOP II) footprint (0.400", 10.16 mm width) enables higher board density and compatibility with space-constrained PCBs.
  • Mid-Density, Parallel Organization: 128 Mbit capacity organized as 8M × 16 provides a balanced density and data width for parallel memory architectures.
  • Deterministic Timing: Specified access time of 700 ps and 12 ns write-cycle time support predictable performance for synchronous memory operations.
  • Low-Voltage Operation: 2.3 V to 2.7 V supply range accommodates low-voltage system designs.
  • Broad Operating Temperature: Rated −40 °C to 85 °C for operation in a wide range of ambient conditions.

Why Choose IC DRAM 128MBIT PAR 66TSOP II?

The IS43R16800E-6TLI positions itself as a compact, mid-density DDR SDRAM option for designers needing a parallel 128 Mbit memory organized as 8M × 16. Its combination of a 166 MHz clock rating, 700 ps access time, and 12 ns write-cycle timing offers predictable synchronous performance for systems requiring parallel DRAM buffering.

With a low-voltage supply range (2.3 V–2.7 V) and an industrial temperature rating (−40 °C to 85 °C), this device is suited to embedded and industrial designs that need a space-efficient TSOP II package and stable memory behavior across temperature extremes.

Request a quote or submit an inquiry to evaluate IS43R16800E-6TLI for your next design or production run.

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