IS43R86400D-6TL-TR

IC DRAM 512MBIT PAR 66TSOP II
Part Description

IC DRAM 512MBIT PAR 66TSOP II

Quantity 40 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency166 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS43R86400D-6TL-TR – IC DRAM 512Mbit PAR 66TSOP II

The IS43R86400D-6TL-TR is a 512 Mbit DDR SDRAM organized as 64M x 8, implemented in a parallel DDR architecture. It provides double-data-rate transfers with dedicated data strobe support, differential clock inputs and an internal DLL for aligned data capture.

This device is designed for compact, commercial-temperature systems requiring a 512 Mbit parallel DDR memory in a 66-pin TSOP-II package, offering programmable burst lengths and CAS latency options for flexible memory timing and bandwidth management.

Key Features

  • Memory Core 512 Mbit DDR SDRAM organized as 64M × 8 with four internal banks to support concurrent operations and pipelined read/write bursts.
  • Double-Data-Rate Architecture Two data transfers per clock cycle with DQS transmitted/received alongside data; DQS is edge-aligned for READs and center-aligned for WRITEs.
  • Clocking and Timing Differential clock inputs (CK / CK̅) and an internal DLL to align DQ/DQS with clock transitions. Programmable CAS latencies of 2, 2.5 and 3 and burst lengths of 2, 4 and 8.
  • Interface and I/O Parallel memory interface with SSTL_2 compatible I/O and Data Mask (DM) support that masks write data on both edges of DQS.
  • Performance Frequency rating up to 166 MHz (speed grade -6) with an access time of 700 ps and write cycle time (word page) of 15 ns.
  • Power VDD and VDDQ operating range 2.3 V to 2.7 V (device -6 grade corresponds to 2.5 V ±0.2 V).
  • Refresh and Power Modes Supports Auto Refresh and Self Refresh modes plus Auto Precharge for standard DRAM refresh management.
  • Package and Temperature 66‑TSSOP (66‑TSOP II) package with a 0°C to +70°C (TA) commercial operating temperature range.

Typical Applications

  • Compact embedded systems Use where a 512 Mbit parallel DDR memory in a 66‑TSOP II package is required for space-constrained boards operating in commercial temperature ranges.
  • High-bandwidth buffering Systems that require burst-capable DDR buffers with programmable CAS latency and DQS-controlled data capture.
  • Standard commercial electronics Devices designed for commercial environments (0°C to +70°C) that need a 2.5 V class parallel DDR memory with SSTL_2 I/O.

Unique Advantages

  • DDR double-data-rate transfers: Enables two data transfers per clock cycle to increase effective data throughput without raising clock frequency.
  • Flexible timing configuration: Programmable CAS latency (2 / 2.5 / 3) and selectable burst lengths (2/4/8) allow tuning for system timing and performance trade-offs.
  • SSTL_2 compatible I/O with DQS: DQS-driven capture and SSTL_2 signaling improve data integrity for parallel DDR interfaces.
  • Compact TSOP-II package: 66‑TSSOP (0.400", 10.16 mm width) provides a small board footprint for space-limited designs.
  • Commercial temperature rating: Specified operation from 0°C to +70°C for standard commercial applications.
  • Standard DDR management features: Auto Refresh, Self Refresh and Auto Precharge support simplify memory refresh and low-power states.

Why Choose IS43R86400D-6TL-TR?

The IS43R86400D-6TL-TR targets designs that require a compact, parallel DDR SDRAM solution with configurable latency and burst behavior. Its combination of 512 Mbit density, SSTL_2 I/O with DQS, differential clocking and an internal DLL delivers predictable timing and burst performance in a small 66‑TSOP II package.

This device is suited to commercial-temperature hardware where a 2.3–2.7 V supply, programmable timing and standard DDR refresh modes are required. Supporting datasheet details and electrical parameters enable engineered integration and timing validation for system-level design.

Request a quote or submit a sales inquiry to receive pricing, availability and lead-time information for the IS43R86400D-6TL-TR.

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