IS45S16160G-7BLA1

IC DRAM 256MBIT PAR 54TFBGA
Part Description

IC DRAM 256MBIT PAR 54TFBGA

Quantity 668 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS45S16160G-7BLA1 – 256Mbit SDRAM, 16M × 16, 54-TFBGA

The IS45S16160G-7BLA1 is a 256Mbit synchronous DRAM device from Integrated Silicon Solution Inc (ISSI) organized as 16M × 16 with a parallel memory interface. It implements a fully synchronous pipeline architecture and LVTTL-compatible signaling to support high-speed data transfer and burst-oriented memory access.

This device addresses designs requiring a 256Mbit parallel SDRAM with programmable burst length and sequence, selectable CAS latency, and on-chip refresh options, delivered in a compact 54-ball TFBGA package and operating over a -40°C to +85°C ambient range.

Key Features

  • Memory Organization  256 Mbit capacity organized as 16M × 16 with internal bank architecture for row access/precharge management.
  • Performance  Speed grade -7 supports a clock frequency up to 143 MHz with an access time from clock of 5.4 ns and programmable CAS latency (2 or 3 clocks).
  • Burst and Sequencing  Programmable burst length (1, 2, 4, 8, full page) and selectable burst sequence (sequential or interleave) for flexible data transfer patterns.
  • Refresh and Power Management  Supports Auto Refresh and Self Refresh; refresh options include 8K refresh cycles every 32 ms (A2 grade) or 64 ms (commercial/industrial/A1 grade).
  • Supply and Interface  Single-supply operation at 3.0 V to 3.6 V (nominal 3.3 V ±0.3 V) with LVTTL-compatible inputs and a parallel memory interface.
  • Package and Temperature Range  54-ball TFBGA (8 × 8) package; specified operating ambient temperature from -40°C to +85°C (TA).

Typical Applications

  • Embedded Systems  Use as high-performance parallel SDRAM in embedded platforms that require deterministic, synchronous memory access at up to 143 MHz.
  • Buffer and Frame Memory  Suited for data buffering or frame buffering where 16M × 16 organization and programmable burst transfers improve throughput.
  • Industrial Electronics  Applicable in industrial designs that need operation across a -40°C to +85°C ambient range and a 3.3 V single-supply memory solution.

Unique Advantages

  • Deterministic synchronous operation  Fully synchronous design with all signals referenced to the positive clock edge simplifies timing analysis and system integration.
  • Flexible performance tuning  Programmable CAS latency and burst options let designers balance latency, throughput, and access patterns for target workloads.
  • Single 3.3 V supply  Operates from 3.0 V to 3.6 V, minimizing the need for additional power rails and simplifying power supply design.
  • Compact BGA package  54-ball TFBGA (8×8) reduces PCB area compared to larger packages while providing standard parallel SDRAM pinout.
  • On-chip refresh management  Auto Refresh and Self Refresh modes with supported refresh intervals reduce external controller overhead for memory retention.

Why Choose IC DRAM 256MBIT PAR 54TFBGA?

The IS45S16160G-7BLA1 positions itself as a straightforward, standards-based 256Mbit parallel SDRAM option for designs that require synchronous, burst-capable memory with configurable timing. Its 16M × 16 organization, programmable burst modes, and selectable CAS latency enable designers to adapt memory behavior to application-specific performance needs.

With single-supply 3.3 V operation, a compact 54-ball TFBGA footprint, and support for industrial ambient temperatures, this device is suitable for teams seeking a reliable memory building block from ISSI when deterministic synchronous DRAM behavior and on-chip refresh features are required.

Request a quote or submit a pricing inquiry to obtain part availability and lead-time information for the IS45S16160G-7BLA1.

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