IS45S16320D-7TLA2

The IS45S16320D-7TLA2 is a 512 Mbit synchronous DRAM (SDRAM) device organized as 32M × 16. It implements a fully synchronous pipeline architecture with internal bank management to support high-speed, clock-referenced data transfers.

This parallel-interface SDRAM is suited to systems that require mid-density, high-throughput volatile memory in a 54-pin TSOP-II package, with a supply range centered around 3.3 V and an extended operating temperature down to −40°C up to 105°C.

Key Features

• Memory Core  512 Mbit SDRAM organized as 32M × 16 bits with internal bank architecture to hide row access and precharge operations.
• Performance  Supports a clock frequency option of 143 MHz (–7 speed grade) with programmable CAS latency (2 or 3 clocks) and an access time from clock of 5.4 ns.
• Interface  Parallel memory interface with LVTTL signaling for synchronous operation; all inputs and outputs are referenced to the rising edge of the clock.
• Burst and Sequencing  Programmable burst lengths (1, 2, 4, 8, full page) and programmable burst sequence (sequential or interleave) with burst termination options via burst stop and precharge commands.
• Refresh and Power Management  Auto Refresh (CBR) and Self Refresh supported with 8K refresh cycles every 64 ms (standard refresh modes documented in the device specification).
• Voltage and Power  Power supply range listed at 3.0 V to 3.6 V; S-type devices reference VDD/VDDQ = 3.3 V in the device specification.
• Package and Temperature  Available in a 54-pin TSOP-II package (0.400", 10.16 mm width) with an operating ambient temperature range of −40°C to +105°C (TA).

Typical Applications

• Parallel-memory system designs  Use as system memory where a 32M × 16 parallel SDRAM provides required volatile storage for mid-density applications.
• High-speed buffering  Suitable for applications that need clock-referenced, pipelined data transfers and programmable burst behavior for short-term data buffering.
• Embedded modules using TSOP-II footprint  Fits designs that require a 54-pin TSOP-II memory package with standard pinout and mechanical dimensions.
• Temperature-demanding environments  Operates across a wide ambient range (−40°C to +105°C) for designs exposed to extended temperature conditions.

Unique Advantages

• Balanced capacity and density: 512 Mbit organization in a 32M × 16 configuration provides ample volatile storage for mid-range memory requirements without moving to larger BGA packages.
• Clock-referenced synchronous operation: All signals referenced to the rising edge of the clock enable predictable timing and pipelined high-speed transfers at the specified 143 MHz grade.
• Flexible burst and latency control: Programmable burst lengths, burst sequence options and CAS latency settings allow tuning for throughput and latency trade-offs in system-level memory access.
• Standard TSOP-II package: 54-pin TSOP-II footprint simplifies integration into existing board designs that require a small-outline parallel SDRAM package.
• Extended operating temperature: Device specified to operate from −40°C to +105°C, supporting designs that must tolerate wide ambient temperature ranges.

Why Choose IS45S16320D-7TLA2?

The IS45S16320D-7TLA2 delivers a practical combination of 512 Mbit capacity, synchronous pipelined architecture, and flexible burst/latency options in a compact 54-pin TSOP-II package. Its 143 MHz speed grade, LVTTL-compatible parallel interface and internal bank management make it appropriate for designs that require predictable, clocked memory performance without migrating to larger-ball-count packages.

This part is well suited to engineers and procurement teams looking for a mid-density SDRAM solution that balances capacity, timing flexibility and a compact mechanical footprint while supporting a broad operating temperature range and standard supply voltages around 3.3 V.

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