IS45S16320F-6BLA1
| Part Description |
IC DRAM 512MBIT PAR 54TFBGA |
|---|---|
| Quantity | 185 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TW-BGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 167 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 32M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS45S16320F-6BLA1 – 512 Mbit Parallel SDRAM, 54‑TFBGA
The IS45S16320F-6BLA1 is a 512 Mbit volatile SDRAM organized as 32M × 16 with a parallel memory interface. Packaged in a 54‑TFBGA (54‑TW‑BGA, 8×13) package, it is specified for operation from −40°C to 85°C (TA) with a supply range of 3.0 V to 3.6 V.
Designed for systems that require parallel SDRAM storage, this device offers defined timing and electrical characteristics including a clock frequency of 167 MHz and an access time of 5.4 ns.
Key Features
- Memory Type Volatile SDRAM providing 512 Mbit of dynamic memory storage.
- Organization 32M × 16 organization for straightforward parallel data bus integration.
- Performance Rated clock frequency of 167 MHz and an access time of 5.4 ns as specified.
- Interface Parallel memory interface for conventional SDRAM system designs.
- Power Operating supply voltage range from 3.0 V to 3.6 V.
- Package 54‑TFBGA package (supplier device package listed as 54‑TW‑BGA, 8×13) for BGA mounting.
- Temperature Range Specified operating ambient temperature range: −40°C to 85°C (TA).
Unique Advantages
- 512 Mbit capacity: Provides a substantial memory footprint in a single SDRAM device for systems requiring mid-density DRAM.
- 32M × 16 organization: Simplifies bus interfacing and address mapping in parallel SDRAM implementations.
- Defined timing performance: 167 MHz clock rating and 5.4 ns access time give clear, verifiable timing characteristics for system timing budgets.
- Wide supply tolerance: 3.0 V to 3.6 V supply range supports designs operating at common 3.3 V logic domains.
- Industrial temperature range: −40°C to 85°C (TA) allows deployment across a wide range of ambient conditions.
- BGA package footprint: 54‑TFBGA (54‑TW‑BGA, 8×13) offers a compact surface-mount solution for space-constrained PCBs.
Why Choose IC DRAM 512MBIT PAR 54TFBGA?
The IS45S16320F-6BLA1 positions as a straightforward, specification-driven SDRAM option when a 512 Mbit parallel DRAM is required. Its 32M × 16 organization, fixed timing metrics (167 MHz clock, 5.4 ns access), and 3.0 V–3.6 V supply range provide clear parameters for integration into parallel-memory systems.
This device is well suited for designs that value a defined electrical and thermal envelope—offering a compact 54‑TFBGA package and an ambient operating range from −40°C to 85°C—so engineers can plan PCB layout, power rails, and thermal considerations with the published specs in hand.
Request a quote or contact sales to discuss availability, lead times, and pricing for the IS45S16320F-6BLA1.
