IS45S16400F-6BLA1-TR
| Part Description |
IC DRAM 64MBIT PARALLEL 54TFBGA |
|---|---|
| Quantity | 762 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS45S16400F-6BLA1-TR – IC DRAM 64MBIT PARALLEL 54TFBGA
The IS45S16400F-6BLA1-TR is a 64 Mbit synchronous DRAM (SDRAM) device organized as 1,048,576 bits × 16 × 4 banks. It implements a fully synchronous pipeline architecture with a parallel LVTTL interface for high-speed, clock-referenced memory operations.
Designed for systems requiring compact parallel DRAM with programmable burst modes and low access latency, this device addresses applications that need deterministic, synchronous memory performance within a −40°C to +85°C ambient range.
Key Features
- Core / Architecture Fully synchronous SDRAM with all signals referenced to the rising clock edge and internal bank architecture to hide row access/precharge latency.
- Memory Organization 64 Mbit capacity organized as 4M × 16 × 4 banks (1,048,576 bits × 16 × 4 banks) for parallel 16-bit data transfers.
- Performance 166 MHz clock option (part suffix -6) with typical access time from clock of 5.4 ns and programmable CAS latency (2 or 3 clocks) to tune read latency.
- Burst & Sequencing Programmable burst length (1, 2, 4, 8, full page) and programmable burst sequence (sequential or interleave) for flexible data transfer patterns.
- Refresh & Power Modes Supports self-refresh and auto-refresh (CBR); datasheet specifies 4096 refresh cycles every 64 ms for commercial/industrial/A1 grades.
- Interface & Signaling LVTTL interface with parallel memory bus for synchronous system integration.
- Power & Supply Single-supply operation in the 3.0 V to 3.6 V range (typical 3.3 V operation).
- Package & Temperature 54-ball TFBGA (8 mm × 8 mm) package with operating ambient temperature range of −40°C to +85°C (TA).
Typical Applications
- Parallel SDRAM memory subsystems Used where a 64 Mbit synchronous parallel DRAM is required for buffered, clocked memory access.
- High-speed buffering Suitable for designs that leverage programmable burst lengths and sequences to optimize sustained data transfers.
- Industrial electronics Operates across a −40°C to +85°C ambient range for temperature-robust embedded systems.
Unique Advantages
- Deterministic synchronous operation: Fully synchronous design with clock-referenced inputs and outputs simplifies timing analysis and system integration.
- Flexible burst control: Programmable burst lengths and sequences allow designers to match memory transfers to system data patterns and throughput needs.
- Low read latency options: Programmable CAS latency (2 or 3 clocks) and access time from clock as low as 5.4 ns enable low-latency reads when required.
- Compact BGA footprint: 54-ball TFBGA (8×8 mm) package reduces PCB area for space-constrained designs.
- Robust refresh management: Supports self-refresh and auto-refresh modes with 4096 refresh cycles per 64 ms for applicable grades to maintain data integrity.
- Standard 3.3 V supply: Single 3.0 V–3.6 V supply range simplifies power rail design in systems using 3.3 V logic.
Why Choose IS45S16400F-6BLA1-TR?
The IS45S16400F-6BLA1-TR provides a compact, fully synchronous 64 Mbit DRAM option that balances low latency, programmable burst flexibility, and a parallel LVTTL interface for straightforward integration into clocked memory subsystems. Its 4-bank architecture and pipeline operation support continuous high-speed transfers while simplifying row/column management.
This device is suited to designers and engineers building embedded systems or memory buffers that require a verified SDRAM solution with a known operating voltage range and ambient temperature rating. Technical details and timing parameters are documented in the device specification for system-level design and timing closure.
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