IS45S16400F-6BLA1-TR

IC DRAM 64MBIT PARALLEL 54TFBGA
Part Description

IC DRAM 64MBIT PARALLEL 54TFBGA

Quantity 762 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of IS45S16400F-6BLA1-TR – IC DRAM 64MBIT PARALLEL 54TFBGA

The IS45S16400F-6BLA1-TR is a 64 Mbit synchronous DRAM (SDRAM) device organized as 1,048,576 bits × 16 × 4 banks. It implements a fully synchronous pipeline architecture with a parallel LVTTL interface for high-speed, clock-referenced memory operations.

Designed for systems requiring compact parallel DRAM with programmable burst modes and low access latency, this device addresses applications that need deterministic, synchronous memory performance within a −40°C to +85°C ambient range.

Key Features

  • Core / Architecture  Fully synchronous SDRAM with all signals referenced to the rising clock edge and internal bank architecture to hide row access/precharge latency.
  • Memory Organization  64 Mbit capacity organized as 4M × 16 × 4 banks (1,048,576 bits × 16 × 4 banks) for parallel 16-bit data transfers.
  • Performance  166 MHz clock option (part suffix -6) with typical access time from clock of 5.4 ns and programmable CAS latency (2 or 3 clocks) to tune read latency.
  • Burst & Sequencing  Programmable burst length (1, 2, 4, 8, full page) and programmable burst sequence (sequential or interleave) for flexible data transfer patterns.
  • Refresh & Power Modes  Supports self-refresh and auto-refresh (CBR); datasheet specifies 4096 refresh cycles every 64 ms for commercial/industrial/A1 grades.
  • Interface & Signaling  LVTTL interface with parallel memory bus for synchronous system integration.
  • Power & Supply  Single-supply operation in the 3.0 V to 3.6 V range (typical 3.3 V operation).
  • Package & Temperature  54-ball TFBGA (8 mm × 8 mm) package with operating ambient temperature range of −40°C to +85°C (TA).

Typical Applications

  • Parallel SDRAM memory subsystems  Used where a 64 Mbit synchronous parallel DRAM is required for buffered, clocked memory access.
  • High-speed buffering  Suitable for designs that leverage programmable burst lengths and sequences to optimize sustained data transfers.
  • Industrial electronics  Operates across a −40°C to +85°C ambient range for temperature-robust embedded systems.

Unique Advantages

  • Deterministic synchronous operation: Fully synchronous design with clock-referenced inputs and outputs simplifies timing analysis and system integration.
  • Flexible burst control: Programmable burst lengths and sequences allow designers to match memory transfers to system data patterns and throughput needs.
  • Low read latency options: Programmable CAS latency (2 or 3 clocks) and access time from clock as low as 5.4 ns enable low-latency reads when required.
  • Compact BGA footprint: 54-ball TFBGA (8×8 mm) package reduces PCB area for space-constrained designs.
  • Robust refresh management: Supports self-refresh and auto-refresh modes with 4096 refresh cycles per 64 ms for applicable grades to maintain data integrity.
  • Standard 3.3 V supply: Single 3.0 V–3.6 V supply range simplifies power rail design in systems using 3.3 V logic.

Why Choose IS45S16400F-6BLA1-TR?

The IS45S16400F-6BLA1-TR provides a compact, fully synchronous 64 Mbit DRAM option that balances low latency, programmable burst flexibility, and a parallel LVTTL interface for straightforward integration into clocked memory subsystems. Its 4-bank architecture and pipeline operation support continuous high-speed transfers while simplifying row/column management.

This device is suited to designers and engineers building embedded systems or memory buffers that require a verified SDRAM solution with a known operating voltage range and ambient temperature rating. Technical details and timing parameters are documented in the device specification for system-level design and timing closure.

Request a quote or submit an inquiry for pricing and availability of the IS45S16400F-6BLA1-TR to receive product and lead-time information.

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