IS45S16400J-6BLA1
| Part Description |
IC DRAM 64MBIT PARALLEL 54TFBGA |
|---|---|
| Quantity | 370 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS45S16400J-6BLA1 – IC DRAM 64MBIT PARALLEL 54TFBGA
The IS45S16400J-6BLA1 is a 64 Mbit volatile SDRAM organized as 4M × 16 with a parallel memory interface. It provides synchronous DRAM operation with a 166 MHz clock rate and fast access performance for designs that require compact, board-mounted parallel memory.
Packaged in a 54‑TFBGA (8×8) form factor and specified for operation from −40°C to 85°C, this device is intended for systems that demand a compact parallel DRAM solution with standard 3.0–3.6 V supply requirements.
Key Features
- Memory Capacity and Organization 64 Mbit capacity organized as 4M × 16 for 16‑bit parallel data paths.
- SDRAM Technology Synchronous DRAM architecture for clocked, predictable memory access.
- Performance Rated clock frequency of 166 MHz with an access time of 5.4 ns for low-latency operations.
- Voltage Supply Operates from 3.0 V to 3.6 V, matching common 3 V system supplies.
- Package 54‑TFBGA (8×8) package case suitable for surface-mount PCB assembly.
- Operating Temperature Specified operating ambient temperature range: −40°C to 85°C (TA).
- Interface Parallel memory interface for direct integration with parallel memory controllers and buses.
Typical Applications
- Embedded memory expansion Integrate as board-level parallel SDRAM to provide 64 Mbit of volatile storage for embedded systems.
- High-speed buffering Use as a parallel buffer or scratch memory where 166 MHz clocking and 5.4 ns access time meet throughput needs.
- Compact PCB designs The 54‑TFBGA (8×8) package enables higher density memory placement in space-constrained assemblies.
Unique Advantages
- Clear memory organization: 4M × 16 configuration simplifies integration with 16‑bit data buses and existing parallel memory controllers.
- Measured performance: 166 MHz clock frequency and 5.4 ns access time provide defined timing characteristics for system timing analysis.
- Standard 3 V supply: 3.0–3.6 V operating range aligns with common system power rails.
- Wide ambient temperature support: −40°C to 85°C rating accommodates designs operating across broad temperature ranges.
- Compact BGA footprint: 54‑TFBGA (8×8) package reduces PCB area for memory placement while supporting surface-mount assembly.
Why Choose IS45S16400J-6BLA1?
The IS45S16400J-6BLA1 delivers a straightforward, specification-driven SDRAM option for designs that require 64 Mbit of parallel volatile memory with defined timing and electrical characteristics. Its 4M × 16 organization, 166 MHz clock rating, and 5.4 ns access time make it suitable for systems that need predictable synchronous memory performance.
This device is appropriate for engineers and procurement teams seeking a compact BGA-packaged SDRAM compatible with 3.0–3.6 V systems and an ambient operating range from −40°C to 85°C, providing a balance of capacity, performance, and board-area efficiency.
Request a quote or submit an inquiry for pricing and availability of the IS45S16400J-6BLA1 to support your design and production timelines.