IS45S16400J-6BLA2-TR
| Part Description |
IC DRAM 64MBIT PARALLEL 54TFBGA |
|---|---|
| Quantity | 1,643 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Automotive | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of IS45S16400J-6BLA2-TR – IC DRAM 64MBIT PARALLEL 54TFBGA
The IS45S16400J-6BLA2-TR is a 64 Mbit volatile SDRAM device organized as 4M × 16 with a parallel memory interface. It delivers synchronous DRAM operation with a specified clock frequency of 166 MHz and an access time of 5.4 ns.
Designed for board-level integration where compact package, defined performance and industrial temperature operation are required, the device supports 3.0 V to 3.6 V supply levels and is offered in a 54‑TFBGA (8×8) package.
Key Features
- Memory Core 64 Mbit SDRAM organized as 4M × 16, volatile DRAM format for system memory and buffer applications.
- Performance Synchronous SDRAM operation with a clock frequency up to 166 MHz and an access time of 5.4 ns for deterministic timing.
- Voltage Supply Operates from 3.0 V to 3.6 V, matching common 3 V system rails.
- Package 54‑TFBGA (8×8) supplier device package for compact board footprint and BGA assembly.
- Operating Temperature Rated for −40 °C to 105 °C (TA), supporting extended temperature operation.
- Interface Parallel memory interface suitable for synchronous DRAM bus architectures.
Typical Applications
- Board-level system memory Use as on-board SDRAM for designs requiring a 4M × 16 parallel memory organization and 64 Mbit capacity.
- Frame buffering and data buffering Provides deterministic SDRAM access (166 MHz clock, 5.4 ns access) for intermediate data storage and buffering tasks.
- Compact embedded modules The 54‑TFBGA (8×8) package enables integration into space-constrained PCBs requiring parallel SDRAM.
Unique Advantages
- Defined SDRAM performance: 166 MHz clock frequency and 5.4 ns access time deliver predictable synchronous memory timing for system designers.
- Compact BGA footprint: 54‑TFBGA (8×8) package reduces board area while supporting standard BGA assembly processes.
- Wide operating temperature: −40 °C to 105 °C rating supports deployment in extended temperature environments.
- Standard 3 V supply: 3.0 V to 3.6 V range aligns with common 3 V system power rails, simplifying power supply design.
- Parallel SDRAM organization: 4M × 16 layout provides a clear memory map for bus-oriented memory architectures.
Why Choose IC DRAM 64MBIT PARALLEL 54TFBGA?
The IS45S16400J-6BLA2-TR positions itself as a compact, spec-driven SDRAM option for systems needing 64 Mbit of parallel volatile memory with defined timing and industrial temperature range. Its 4M × 16 organization, 166 MHz clock capability and 5.4 ns access time make it suitable for designs that require predictable synchronous memory behavior and a small BGA footprint.
Engineers specifying this device benefit from a straightforward supply voltage range (3.0 V–3.6 V) and a 54‑TFBGA package option for space-conscious PCBs, delivering a balance of performance, integration and thermal tolerance for long-term deployments.
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