IS45S32400F-6TLA2-TR

The IS45S32400F-6TLA2-TR is a 128‑Mbit volatile SDRAM device organized as 4M × 32 with a parallel memory interface. It delivers 166 MHz clock operation and a 5.4 ns access time in an 86‑TSOP II (10.16 mm width) package.

Designed for applications that require compact, parallel DRAM memory, this device offers industry‑standard supply and thermal ranges with a 3.0–3.6 V supply and an operating temperature range of −40 °C to 105 °C.

Key Features

• Memory Core 128 Mbit volatile DRAM implemented as SDRAM for parallel memory operation.
• Organization 4M × 32 memory organization providing a 32‑bit wide data path.
• Performance Rated for a 166 MHz clock frequency with a 5.4 ns access time.
• Voltage Supply Operates from 3.0 V to 3.6 V, matching standard 3 V SDRAM supply rails.
• Package 86‑TSOP II (0.400", 10.16 mm width) supplier device package for compact board-level integration.
• Operating Temperature Wide operating range from −40 °C to 105 °C (TA) suitable for elevated temperature environments.
• Interface Parallel memory interface suitable for board designs expecting standard DRAM signaling.

Typical Applications

• Parallel memory subsystems — Used where a 32‑bit parallel SDRAM is required to provide temporary storage and buffering in system designs.
• Board-level DRAM implementations — Suitable for integration on printed circuit boards needing a compact 86‑TSOP II packaged DRAM.
• High-speed buffering — Employed in designs that utilize a 166 MHz clock and 5.4 ns access timing for short-latency data buffering.

Unique Advantages

• 128 Mbit density: Provides substantial memory capacity in a single 4M × 32 device, simplifying board design for mid-density DRAM needs.
• Fast access timing: 5.4 ns access time and 166 MHz clock rating enable low-latency memory operations where timing matters.
• Standard 3.0–3.6 V supply: Compatible with common 3 V SDRAM power rails, easing power‑supply design and system integration.
• Compact TSOP II package: 86‑TSOP II form factor with 10.16 mm width supports compact board layouts and straightforward solder mounting.
• Extended temperature range: −40 °C to 105 °C operation supports deployments in thermally demanding environments.

Why Choose IS45S32400F-6TLA2-TR?

The IS45S32400F-6TLA2-TR provides a balanced combination of capacity, speed, and standard interfacing in a compact 86‑TSOP II package. Its 4M × 32 organization, 166 MHz clock capability, and 5.4 ns access time make it a suitable choice for designs requiring parallel SDRAM with reliable timing and moderate density.

This device is appropriate for engineers specifying board-level DRAM where 3.0–3.6 V supply compatibility and an extended −40 °C to 105 °C operating range are important. It offers straightforward integration for systems targeting compact form factors and consistent DRAM performance.

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