IS45S32400F-6TLA2

The IS45S32400F-6TLA2 is a volatile SDRAM memory device with a 128 Mbit capacity organized as 4M × 32. It implements a parallel memory interface and is offered in an 86‑TSOP II (10.16 mm width) package.

Designed for system-level memory expansion, the device targets applications that require a parallel SDRAM with a 166 MHz clock capability, a 5.4 ns access time, 3.0–3.6 V supply range, and an extended operating temperature range of −40 °C to 105 °C.

Key Features

• Memory Architecture 128 Mbit capacity arranged as 4M × 32, providing a wide 32‑bit data path for parallel memory operations.
• SDRAM Technology Synchronous DRAM architecture with parallel interface for standard SDRAM system integration.
• Performance Supports a clock frequency of 166 MHz and specified access time of 5.4 ns to meet moderate-performance memory timing needs.
• Power Operates from a 3.0 V to 3.6 V supply range compatible with common 3.3 V system rails.
• Package and Mounting Supplied in an 86‑TSOP II (0.400", 10.16 mm width) surface‑mount package for board‑level implementations.
• Environmental Range Rated for operation from −40 °C to 105 °C (TA), supporting deployments in wide‑temperature environments.

Typical Applications

• Embedded systems — Board‑level parallel SDRAM memory for embedded controllers and processors requiring 128 Mbit working storage.
• Industrial equipment — Memory solution for systems that require operation across −40 °C to 105 °C.
• Memory expansion — On‑board DRAM expansion where a 32‑bit parallel data path and 86‑TSOP II footprint are required.
• 3.3 V systems — Integration into designs powered from 3.0–3.6 V supply rails.

Unique Advantages

• 128 Mbit density: Provides a compact high‑capacity memory option without increasing chip count.
• 4M × 32 organization: Wide 32‑bit data path simplifies bus interfacing and supports efficient parallel transfers.
• 166 MHz clock support: Enables synchronous operation at common SDRAM timing for moderate throughput needs.
• Wide operating temperature: −40 °C to 105 °C rating supports applications in extended temperature environments.
• Standard 3.0–3.6 V operation: Compatible with typical 3.3 V system architectures for straightforward power integration.
• 86‑TSOP II package: Compact surface‑mount footprint suitable for constrained board layouts.

Why Choose IS45S32400F-6TLA2?

The IS45S32400F-6TLA2 combines a 128 Mbit SDRAM architecture with a 4M × 32 organization and a parallel interface, delivering a straightforward memory building block for designs that require a wide data path and synchronous operation. Its 166 MHz clock capability and 5.4 ns access time provide predictable timing for system memory subsystems.

With a 3.0–3.6 V supply range and an extended −40 °C to 105 °C operating window, this ISSI device suits a range of board‑level applications where standard voltage compatibility, compact TSOP II packaging, and wide temperature tolerance are important considerations.

Request a quote or submit an inquiry to obtain pricing and availability for the IS45S32400F-6TLA2.