IS45S32400F-7BLA1-TR

The IS45S32400F-7BLA1-TR is a 128 Mbit volatile DRAM device implemented as SDRAM with a parallel memory interface. It is organized as 4M × 32 bits and operates at a clock frequency up to 143 MHz, delivering a compact DRAM option in a 90‑TFBGA (8×13) package.

Designed for system-level memory integration, the device supports standard 3.0 V to 3.6 V supply ranges and an ambient operating temperature from −40 °C to 85 °C, making it suitable for designs that require defined electrical and thermal operating windows.

Key Features

• Memory Type & Capacity 128 Mbit volatile DRAM, organized as 4M × 32 bits for parallel data paths.
• SDRAM Architecture Synchronous DRAM (SDRAM) core supporting parallel interface operation with defined access timing.
• Performance Rated clock frequency up to 143 MHz and access time of 5.4 ns, providing deterministic SDRAM timing for system memory slots.
• Power Supply Operates from a 3.0 V to 3.6 V supply range to match common 3 V SDRAM power rails.
• Package 90‑TFBGA (8×13) supplier device package that supports board-level placement in compact form factors.
• Operating Temperature Specified for ambient operation from −40 °C to 85 °C.
• Interface Parallel memory interface suitable for systems requiring conventional SDRAM bus connectivity.

Typical Applications

• Parallel memory subsystems — Acts as a 128 Mbit parallel SDRAM component where 4M × 32 organization is required.
• Board-level DRAM expansions — Suitable for designs needing a compact 90‑TFBGA package for additional volatile memory.
• Temperature-conditioned designs — Fits systems operating within the −40 °C to 85 °C ambient range.

Unique Advantages

• Defined capacity and organization: 128 Mbit in a 4M × 32 configuration simplifies memory mapping and bus planning.
• Synchronous operation at up to 143 MHz: Provides predictable SDRAM timing with a specified 5.4 ns access time for system-level integration.
• Standard 3.0–3.6 V supply: Matches common 3 V SDRAM rails to ease power-supply design and compatibility.
• Compact ball grid package: 90‑TFBGA (8×13) enables high-density placement on PCBs where board space is limited.
• Wide operating temperature: −40 °C to 85 °C qualification supports use in thermally varied ambient conditions.

Why Choose IS45S32400F-7BLA1-TR?

The IS45S32400F-7BLA1-TR positions itself as a straightforward SDRAM option for systems requiring a 128 Mbit parallel memory device with defined timing and supply requirements. Its 4M × 32 organization, 143 MHz clock rating, and 5.4 ns access time provide clear electrical parameters for system integration and memory map planning.

This device is appropriate for designs that need a compact 90‑TFBGA package and operation across a −40 °C to 85 °C ambient range, offering predictable performance and clear specification boundaries for procurement and hardware validation.

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