M12L2561616A-7B(2T)

256Mb SDRAM
Part Description

SDRAM 3.3V

Quantity 1,203 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54 pin TSOPII/ 54 Ball FBGAMemory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5 nsGradeCommercial
Clock Frequency143 MHzVoltage2.5VMemory TypeVolatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page14 nsPackaging54 pin TSOPII/ 54 Ball FBGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization16M x 16
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.24

Overview of M12L2561616A-7B(2T) – SDRAM 3.3V

The M12L2561616A-7B(2T) from ESMT is a synchronous DRAM device organized as 16M × 16, providing 268.4 Mbit of volatile memory in a high-data-rate SDRAM architecture with four internal banks. It is designed for high-bandwidth, high-performance memory system applications requiring precise cycle control and flexible access modes.

This device supports programmable burst lengths and latencies, JEDEC qualification, and is offered in surface-mount TSOP II and BGA54 packages to suit a range of assembly and board-layout requirements.

Key Features

  • Memory Capacity & Organization 268.4 Mbit total capacity organized as 16M × 16 bits across four banks for parallel, high-throughput access.
  • Performance Rated to 143 MHz with an access time of 5 ns and a write cycle time (word page) of 14 ns to support synchronous, high-data-rate operation.
  • Programmable Burst & Latency Supports CAS latency 2 and 3, programmable burst lengths (1, 2, 4, 8 and full page) and burst types (sequential and interleave) for flexible throughput tuning.
  • Synchronous Interface All inputs are sampled on the positive edge of the system clock; LVTTL compatible address multiplexing and parallel memory interface simplify timing integration.
  • Refresh & Power Management Auto and self refresh supported with a 64 ms refresh period (8K cycles); CKE pin available to freeze operation and reduce power in standby.
  • Signal Masking & Data Control DQM (data mask) support for read/write masking; separate LDQM/UDQM signals available per device pinout.
  • Package & Mounting Available in 54-pin TSOP II and 54-ball FBGA (BGA54) surface-mount packages to accommodate different PCB and thermal design constraints.
  • Power & Compliance Datasheet references JEDEC-standard 3.3V power supply and the product is RoHS compliant; device qualification: JEDEC.
  • Operating Range Commercial grade operating temperature range of 0 °C to 70 °C.

Typical Applications

  • High-bandwidth memory systems — Ideal for applications that require synchronous, high-data-rate DRAM with programmable burst behavior and low-latency access.
  • Embedded systems with high-throughput needs — Suited for designs that need parallel SDRAM organization and flexible timing control.
  • Board-level designs requiring compact surface-mount memory — TSOP II and BGA54 packages provide options for dense PCB layouts and assembly processes.

Unique Advantages

  • Flexible throughput tuning — Programmable burst lengths and CAS latencies allow designers to optimize for bandwidth or latency per application requirements.
  • Four-bank architecture — Banked internal organization improves concurrency and sustained data transfer rates for high-performance memory access patterns.
  • Commercial-grade, JEDEC-qualified — Qualification to JEDEC standards provides predictable interoperability and a defined compliance baseline.
  • Surface-mount package choices — Availability in 54-pin TSOP II and 54-ball FBGA supports multiple assembly and thermal strategies.
  • Power-management features — Auto/self refresh and clock-enable (CKE) support help manage standby power without sacrificing system-level refresh integrity.
  • RoHS-compliant — Pb-free manufacturing aligns with lead-free assembly and environmental compliance requirements.

Why Choose M12L2561616A-7B(2T)?

The M12L2561616A-7B(2T) delivers a practical combination of synchronous high-data-rate performance and flexible timing features tailored to high-bandwidth memory system designs. Its 16M × 16 organization, four-bank architecture, and support for programmable burst lengths and CAS latencies make it a strong fit for engineers seeking controllable throughput and low-latency operation in commercial-temperature applications.

With JEDEC qualification, RoHS compliance, and surface-mount package options (54-pin TSOP II or 54-ball FBGA), this ESMT SDRAM part supports a range of board-level implementations while maintaining predictable electrical and timing behavior for production designs.

Request a quote or submit an inquiry to receive pricing and availability for the M12L2561616A-7B(2T).

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1998


    Headquarters: Hsinchu Science Park, Hsinchu, Taiwan


    Employees: 400+


    Revenue: $377.8 Million


    Certifications and Memberships: N/A


    Featured Products
    Latest News
    keyboard_arrow_up