M12L2561616A-7B(2T)
| Part Description |
SDRAM 3.3V |
|---|---|
| Quantity | 1,203 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 54 pin TSOPII/ 54 Ball FBGA | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 2.5V | Memory Type | Volatile | ||
| Operating Temperature | 0°C – 70°C | Write Cycle Time Word Page | 14 ns | Packaging | 54 pin TSOPII/ 54 Ball FBGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.24 |
Overview of M12L2561616A-7B(2T) – SDRAM 3.3V
The M12L2561616A-7B(2T) from ESMT is a synchronous DRAM device organized as 16M × 16, providing 268.4 Mbit of volatile memory in a high-data-rate SDRAM architecture with four internal banks. It is designed for high-bandwidth, high-performance memory system applications requiring precise cycle control and flexible access modes.
This device supports programmable burst lengths and latencies, JEDEC qualification, and is offered in surface-mount TSOP II and BGA54 packages to suit a range of assembly and board-layout requirements.
Key Features
- Memory Capacity & Organization 268.4 Mbit total capacity organized as 16M × 16 bits across four banks for parallel, high-throughput access.
- Performance Rated to 143 MHz with an access time of 5 ns and a write cycle time (word page) of 14 ns to support synchronous, high-data-rate operation.
- Programmable Burst & Latency Supports CAS latency 2 and 3, programmable burst lengths (1, 2, 4, 8 and full page) and burst types (sequential and interleave) for flexible throughput tuning.
- Synchronous Interface All inputs are sampled on the positive edge of the system clock; LVTTL compatible address multiplexing and parallel memory interface simplify timing integration.
- Refresh & Power Management Auto and self refresh supported with a 64 ms refresh period (8K cycles); CKE pin available to freeze operation and reduce power in standby.
- Signal Masking & Data Control DQM (data mask) support for read/write masking; separate LDQM/UDQM signals available per device pinout.
- Package & Mounting Available in 54-pin TSOP II and 54-ball FBGA (BGA54) surface-mount packages to accommodate different PCB and thermal design constraints.
- Power & Compliance Datasheet references JEDEC-standard 3.3V power supply and the product is RoHS compliant; device qualification: JEDEC.
- Operating Range Commercial grade operating temperature range of 0 °C to 70 °C.
Typical Applications
- High-bandwidth memory systems — Ideal for applications that require synchronous, high-data-rate DRAM with programmable burst behavior and low-latency access.
- Embedded systems with high-throughput needs — Suited for designs that need parallel SDRAM organization and flexible timing control.
- Board-level designs requiring compact surface-mount memory — TSOP II and BGA54 packages provide options for dense PCB layouts and assembly processes.
Unique Advantages
- Flexible throughput tuning — Programmable burst lengths and CAS latencies allow designers to optimize for bandwidth or latency per application requirements.
- Four-bank architecture — Banked internal organization improves concurrency and sustained data transfer rates for high-performance memory access patterns.
- Commercial-grade, JEDEC-qualified — Qualification to JEDEC standards provides predictable interoperability and a defined compliance baseline.
- Surface-mount package choices — Availability in 54-pin TSOP II and 54-ball FBGA supports multiple assembly and thermal strategies.
- Power-management features — Auto/self refresh and clock-enable (CKE) support help manage standby power without sacrificing system-level refresh integrity.
- RoHS-compliant — Pb-free manufacturing aligns with lead-free assembly and environmental compliance requirements.
Why Choose M12L2561616A-7B(2T)?
The M12L2561616A-7B(2T) delivers a practical combination of synchronous high-data-rate performance and flexible timing features tailored to high-bandwidth memory system designs. Its 16M × 16 organization, four-bank architecture, and support for programmable burst lengths and CAS latencies make it a strong fit for engineers seeking controllable throughput and low-latency operation in commercial-temperature applications.
With JEDEC qualification, RoHS compliance, and surface-mount package options (54-pin TSOP II or 54-ball FBGA), this ESMT SDRAM part supports a range of board-level implementations while maintaining predictable electrical and timing behavior for production designs.
Request a quote or submit an inquiry to receive pricing and availability for the M12L2561616A-7B(2T).
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A