M13S2561616A-6BIG2T

The M13S2561616A-6BIG2T is a JEDEC‑qualified DDR SDRAM device organized as 4M × 16 bits, providing 268.4 Mbit of volatile memory in a compact 60‑ball BGA surface‑mount package. It implements a double‑data‑rate architecture with differential clock inputs and bi‑directional data strobes to deliver two data transfers per clock cycle at a 166 MHz maximum operating clock frequency.

Designed for industrial applications, the device operates over a −40 °C to 85 °C ambient range and accepts a supply range of 2.3 V to 2.7 V (2.5 V ±0.2 V), offering a compact, low‑voltage memory option for embedded and board‑level designs requiring JEDEC compliance and sustained high‑rate data transfers.

Key Features

• Core Architecture
  4M × 16 organization with four internal banks and double‑data‑rate operation for two data transfers per clock cycle.
• High‑rate Performance
  Rated for 166 MHz clock frequency (DDR333) with typical access and write cycle timings of 15 ns, and selectable CAS latencies of 2, 2.5, and 3.
• Data I/O and Clocking
  Bi‑directional DQS data strobe (LDQS/UDQS) with DQS edge/center alignment behavior, differential clock inputs (CLK/CLK̄), and on‑die DLL to align DQ/DQS with CLK transitions.
• Burst and Timing Flexibility
  Burst lengths of 2, 4, and 8 with sequential and interleave burst types; all inputs except data and DM are sampled on the rising edge of CLK.
• Power and Signaling
  VDD/VDDQ = 2.5 V ±0.2 V (listed supply range 2.3 V–2.7 V) with SSTL_2‑compatible 2.5 V I/O signaling and data mask (DM) inputs for write masking.
• Reliability and Refresh
  JEDEC qualification, auto and self refresh support, and a 7.8 μs refresh interval for standard DRAM retention management.
• Package and Temperature
  Surface‑mount 60‑ball BGA package with operating ambient temperature range of −40 °C to 85 °C and RoHS compliance.

Typical Applications

• Industrial Embedded Systems — JEDEC‑qualified DDR SDRAM with −40 °C to 85 °C operation for board‑level memory in industrial controllers and embedded equipment.
• High‑Speed Buffering and Data Transfers — DDR architecture and 166 MHz clock rating for designs that require efficient parallel data buffering at double data rate.
• Compact, Board‑Mounted Designs — 60‑BGA surface‑mount package and 2.5 V signaling suited to space‑constrained PCBs and dense memory arrays.

Unique Advantages

• Industrial Temperature Range: Operation from −40 °C to 85 °C enables deployment in temperature‑challenging environments.
• JEDEC Qualification: Industry standard qualification simplifies integration and design verification for DDR SDRAM functions.
• Double‑Data‑Rate Throughput: Two transfers per clock cycle with DQS and DLL alignment improve effective data bandwidth while maintaining signal timing control.
• Flexible Timing Options: Multiple CAS latencies and burst lengths allow designers to trade latency and throughput to match system requirements.
• Low‑Voltage Operation: 2.3 V–2.7 V supply (2.5 V nominal) and SSTL_2‑compatible I/O support lower power and standard DDR signaling conventions.
• Compact BGA Footprint: 60‑ball BGA package for high‑density PCB layouts and surface‑mount assembly processes.

Why Choose M13S2561616A-6BIG2T?

The M13S2561616A-6BIG2T positions itself as a compact, JEDEC‑qualified DDR SDRAM device that combines DDR double‑data‑rate architecture, flexible timing options, and industrial‑grade temperature tolerance. Its 4M × 16 organization, 166 MHz clock rating, and built‑in features such as DLL, DQS, and auto/self refresh provide predictable timing and retention behavior for embedded and board‑level memory needs.

This part is suitable for design teams requiring a low‑voltage (2.5 V nominal) DDR memory in a 60‑BGA package with RoHS compliance and an operating range tailored to industrial deployments. It delivers a balanced mix of performance, integration density, and JEDEC compatibility for long‑term, robust memory implementations.

Request a quote or submit an inquiry to order M13S2561616A-6BIG2T and get detailed pricing and availability information for your project requirements.