M14D5121632A-2.5BBG2M

The M14D5121632A-2.5BBG2M is a 512 Mbit DDR2 SDRAM organized as 32M × 16 with a 400 MHz clock (DDR2-800) and 1.8 V nominal supply. It implements a pipelined double-data-rate architecture with on-chip DLL and differential clock inputs to support standard DDR2 timing and burst operations. Designed for surface-mount applications, the device is offered in a thin 84‑FBGA package (1.0 mm body height) and is JEDEC compliant.

Key Features

• Core & Architecture Internal pipelined DDR2 architecture with on-chip DLL, quad-bank operation and differential clock inputs for DDR2-800 performance.
• Memory Organization 32M × 16 organization delivering 512 Mbit density with burst length options of 4 or 8 and both sequential and interleave burst types.
• Timing Options Support for CAS latency settings (3–9) and additive latency (0–7); typical timing example for this ordering code is DDR2-800 (5-5-5).
• Data I/O and Strobes Bi-directional differential data strobe (DQS/ DQS¯) with edge-aligned READ and center-aligned WRITE timing; separate LDQS/UDQS groups for DQ0–DQ7 and DQ8–DQ15.
• On-Die Features On-die termination (ODT) with selectable values (50/75/150 Ω) and off-chip-driver (OCD) impedance adjustment to improve signal integrity.
• Refresh and Power Management Auto and self-refresh support, Partial Array Self Refresh (PASR) and high-temperature self-refresh modes; JEDEC refresh cycles specified (8192 cycles/64 ms at 0°C–85°C; 8192 cycles/32 ms at 85°C–95°C).
• Voltage and Interface Nominal VDD/VDDQ = 1.8 V (±0.1 V), operational supply range 1.7 V–1.9 V; SSTL_18-compatible interface.
• Package & Mounting 84‑ball FBGA thin package (8 × 12.5 mm footprint, 0.8 mm ball pitch, 1.0 mm max body height) for surface-mount assembly.
• Qualification & Compliance JEDEC standard DDR2 SDRAM design and RoHS compliant. Commercial grade operation.

Typical Applications

• DDR2 memory subsystems — Use where a 512 Mbit DDR2-800, 1.8 V component is required for system memory or local buffering.
• Compact BGA designs — Thin 84‑FBGA (1.0 mm) package suits densely populated PCBs and space‑constrained assemblies.
• Thermally demanding environments — Operates across a commercial temperature range of 0°C to 95°C with JEDEC-defined refresh behavior for higher-temperature operation.

Unique Advantages

• JEDEC-compliant DDR2 timing: Facilitates integration into standard DDR2 memory controllers with supported CAS and additive latency options.
• Flexible signal integrity controls: On-die termination and OCD impedance adjustment allow tuning of termination and drive strength for reliable high-speed signaling.
• Compact, thin FBGA package: 84‑ball FBGA (1.0 mm body) provides a small footprint and low profile for space-limited board designs.
• Standard 1.8 V operation: Compatibility with DDR2 power rails simplifies power supply design across the system.
• Built-in refresh and low-power modes: Auto/self-refresh and PASR support help manage standby power and memory retention across required temperature ranges.

Why Choose M14D5121632A-2.5BBG2M?

The M14D5121632A-2.5BBG2M delivers JEDEC-standard DDR2-800 performance in a 512 Mbit (32M × 16) configuration with a thin 84‑FBGA package suited to compact, surface-mount designs. Its combination of on-die termination, differential clocking, programmable timing options and defined refresh behavior provides predictable integration into DDR2 memory subsystems where 1.8 V operation and commercial temperature range are required.

This device is appropriate for designs that require standard DDR2 timing flexibility, signal-integrity controls, and a low-profile BGA package for dense PCB layouts. The JEDEC compliance and RoHS status support consistent manufacturing and environmental requirements.

Request a quote or submit a procurement inquiry today to evaluate M14D5121632A-2.5BBG2M for your next DDR2 memory design.