M15T1G1664A-BDBG2K

The M15T1G1664A-BDBG2K is a DDR3L SDRAM device organized as 64M×16 for a total memory capacity of 1.074 Gbit. It implements DDR3L DRAM architecture with a parallel memory interface and an 800 MHz clock frequency for synchronous data transfers.

This device supports dual supply voltages (1.35 V and 1.5 V), JEDEC qualification, and a wide operating temperature range from -40 °C to 105 °C, meeting requirements for designs that need compact, board-mounted DDR3L memory in a 96 Ball BGA package.

Key Features

• Core / Memory 1.074 Gbit total capacity organized as 64M×16, providing a standard DDR3L memory density for system memory applications.
• Performance Synchronous DDR3L operation with a clock frequency of 800 MHz and an access time of 13.75 ns; write cycle time (word page) is 15 ns.
• Power Dual voltage support at 1.35 V and 1.5 V to accommodate low-voltage DDR3L designs and conventional DDR3 supply options.
• Interface Parallel memory interface compatible with standard DDR3L system architectures.
• Package & Mounting Surface-mount 96 Ball BGA package optimized for compact board-level integration.
• Reliability & Qualification JEDEC qualification noted in product data; grade is listed as Automotive.
• Operating Range Rated for operation from -40 °C to 105 °C for temperature-extensive deployments.
• Environmental RoHS compliant according to product data.

Typical Applications

• System memory for embedded designs — Provides board-level DDR3L memory capacity and timing suited to embedded controllers and memory subsystems.
• Low-voltage DDR3 platforms — Dual 1.35 V / 1.5 V support allows use in designs targeting reduced power domains.
• Compact, high-density boards — 96 Ball BGA package enables dense PCB layouts where board space is constrained.

Unique Advantages

• 800 MHz DDR3L timing: Enables synchronous memory operation with a specified 13.75 ns access time and 15 ns write cycle time for predictable performance.
• Flexible voltage operation: Support for both 1.35 V and 1.5 V allows designers to choose low-voltage operation or standard DDR3 supply rails.
• Compact BGA footprint: 96 Ball BGA package supports high-density board integration and surface-mount assembly.
• Wide operating temperature: -40 °C to 105 °C rating supports use across temperature-extensive environments.
• Standards-based qualification: JEDEC qualification is specified in the product data, aligning with standard memory ecosystem expectations.
• RoHS compliant: Meets RoHS environmental requirements as stated in the product data.

Why Choose M15T1G1664A-BDBG2K?

The M15T1G1664A-BDBG2K delivers a compact DDR3L memory solution combining a 1.074 Gbit density, 800 MHz synchronous operation, and flexible 1.35 V / 1.5 V power options. Its 96 Ball BGA package and broad operating temperature range make it suitable for designs that prioritize board-level density and temperature robustness.

With JEDEC qualification and RoHS compliance noted in the product data, this DDR3L device is intended for engineers and procurement teams seeking a standardized, surface-mount memory component for integration into systems requiring DDR3L DRAM.

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