M15T1G1664A-DEBG2Z

The M15T1G1664A-DEBG2Z is a DDR3L SDRAM device organized as 64M × 16 for a total memory size of 1.074 Gbit. It implements DDR3L DRAM technology with a parallel memory interface and JEDEC qualification.

This device supports 1.35V and 1.5V supply options, a clock frequency of 933 MHz (DDR3(L)-1866), access time of 13.91 ns and a write cycle time (word page) of 15 ns. It is supplied in a 96 Ball BGA surface-mount package and rated for commercial operating temperatures from 0 °C to 85 °C.

Key Features

• Core / Memory Organization 1.074 Gbit capacity organized as 64M × 16, suitable for designs requiring this density and data width.
• Memory Technology DDR3L volatile DRAM with a parallel memory interface and JEDEC qualification for standardized DDR3(L) operation.
• Performance & Timing 933 MHz clock frequency (DDR3(L)-1866), 13.91 ns access time, and 15 ns write cycle time (word page) provide defined timing characteristics for system integration.
• Power Dual supply support at 1.35 V and 1.5 V to match DDR3L platform voltage requirements.
• Package & Mounting 96 Ball BGA package for surface-mount PCB assembly and compact board-level integration.
• Operating Range & Qualification Commercial operating temperature range of 0 °C to 85 °C and JEDEC qualification; RoHS compliant.

Typical Applications

• JEDEC-compliant DDR3L platforms Use as system memory where JEDEC DDR3L compatibility and DDR3(L)-1866 timing are required.
• High-density memory modules Integration into designs that require a 1.074 Gbit DRAM organized as 64M × 16 for defined capacity and data width.
• Surface-mount PCB assemblies Suitable for board-level designs that accept a 96 Ball BGA package for compact footprint and soldered integration.

Unique Advantages

• JEDEC Qualification: Ensures compatibility with JEDEC-defined DDR3L timing and signaling conventions for predictable system behavior.
• Dual Voltage Support: Operates at 1.35 V and 1.5 V, providing flexibility for systems using DDR3L voltage rails.
• Defined Performance Metrics: 933 MHz clock frequency with 13.91 ns access time and 15 ns write cycle time for clear timing integration.
• Compact BGA Packaging: 96 Ball BGA surface-mount package facilitates space-efficient board design and standard assembly processes.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match a wide range of general-purpose electronic applications.
• RoHS Compliant: Meets RoHS environmental requirements for lead-free assembly and regulatory adherence.

Why Choose M15T1G1664A-DEBG2Z?

The M15T1G1664A-DEBG2Z positions itself as a JEDEC-qualified DDR3L memory device offering a clear combination of capacity (1.074 Gbit), defined timing (933 MHz, 13.91 ns access), and packaging (96 Ball BGA) for board-level integration. Its dual-voltage support (1.35 V / 1.5 V) and commercial operating range make it suitable for designs requiring standardized DDR3L memory behavior and compact assembly.

This part is appropriate for designers and procurement teams specifying DDR3L SDRAM in systems that demand verifiable timing, JEDEC compatibility, and a BGA surface-mount form factor, with RoHS compliance for environmentally conscious builds.

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