M15T1G1664A-DEBG2K

The M15T1G1664A-DEBG2K from ESMT is a 1.074 Gbit DDR3L SDRAM device in a 64M × 16 organization, offered as part of the M15T1G1664A series. It implements DDR3L technology with a 933 MHz clock frequency (DDR3(L)-1866 timing) and JEDEC qualification for standard DRAM interoperability.

This surface-mount component is supplied in a 96-ball BGA package, supports dual supply voltages of 1.35 V and 1.5 V, and operates across an extended temperature range of −40 °C to 105 °C. It is RoHS compliant and intended for systems requiring parallel DRAM memory integration.

Key Features

• Memory Organization  The device is organized as 64M × 16, providing a total memory size of 1.074 Gbit for mid-density DRAM requirements.
• DDR3L Technology & Timing  Supports DDR3L operation with a clock frequency of 933 MHz (DDR3(L)-1866 timing) and access time of 13.91 ns for timed memory access.
• Power Options  Dual voltage supply support at 1.35 V and 1.5 V to accommodate DDR3L and standard DDR3 system voltages.
• Performance Timing  Write cycle time (word page) specified at 15 ns, suitable for synchronous DRAM workflows.
• Package & Mounting  96 Ball BGA package in a surface-mount form factor for compact PCB integration and mass assembly.
• Environmental & Operating Range  Rated for operation from −40 °C to 105 °C and RoHS compliant for regulated material requirements.
• Standards Qualification  JEDEC qualification for industry-standard DRAM interoperability and predictable behavior in compliant designs.

Unique Advantages

• High-density footprint: 1.074 Gbit capacity in a 64M × 16 organization delivers substantial memory in a compact BGA package, simplifying board-level memory planning.
• Flexible voltage operation: Native support for both 1.35 V and 1.5 V supplies enables integration into systems targeting DDR3L or DDR3 voltage rails.
• Extended temperature capability: Operating range of −40 °C to 105 °C supports deployment in designs that require broader thermal tolerance.
• JEDEC interoperability: JEDEC qualification helps ensure predictable timing and compatibility with JEDEC-compliant memory controllers and interfaces.
• Compact BGA package: The 96-ball BGA offers a small PCB footprint with surface-mount assembly suitable for automated manufacturing.
• Regulatory compliance: RoHS compliance supports material-restricted design and regulatory requirements.

Why Choose M15T1G1664A-DEBG2K?

The M15T1G1664A-DEBG2K positions itself as a robust DDR3L SDRAM option for designs that require a mid-density, JEDEC-qualified DRAM in a compact BGA package. With dual-voltage support and an extended operating temperature range, it fits applications where flexible power architectures and wide thermal tolerance are necessary.

This ESMT device is suitable for engineers and procurement teams seeking a standardized DDR3L memory building block with clear electrical and timing specifications, compact surface-mount packaging, and RoHS compliance for regulated environments.

Request a quote or submit an inquiry to get pricing, lead time, and availability for the M15T1G1664A-DEBG2K. Our team can provide specification support and ordering information to help integrate this DDR3L SDRAM into your design.