M15T2G8256A-DEBG2D

2Gb DDR3L SDRAM
Part Description

DDR3L SDRAM 2Gb (256M × 8) 933 MHz 78 Ball BGA

Quantity 847 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusNot for new design
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package78 Ball BGAMemory FormatDRAMTechnologyDDR3L
Memory Size2 GbitAccess Time13.75 nsGradeCommercial
Clock Frequency933 MHzVoltage1.35V, 1.5VMemory TypeVolatile
Operating Temperature0°C – 85°CWrite Cycle Time Word Page15 nsPackaging78 Ball BGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization256M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.36

Overview of M15T2G8256A-DEBG2D – DDR3L SDRAM 2Gb (256M × 8) 933 MHz 78 Ball BGA

The M15T2G8256A-DEBG2D is a DDR3L SDRAM device with a 2.147 Gbit memory density organized as 256M × 8. Implemented in DDR3L technology, it supports a 933 MHz clock frequency and is offered in a 78 Ball BGA surface-mount package.

This JEDEC-qualified, commercial-grade DRAM is designed for system memory applications where a compact BGA footprint, dual-voltage support, and defined operating temperature range are required.

Key Features

  • Memory Density & Organization 2.147 Gbit capacity organized as 256M × 8, suitable for moderate-density memory subsystems.
  • Clock Frequency & Timing Supports a 933 MHz clock frequency with an access time of 13.75 ns and a write cycle time (word page) of 15 ns.
  • DDR3L Technology Implemented in DDR3L SDRAM technology and identified for DDR3(L)-1866 operation.
  • Voltage Supply Supports 1.35 V and 1.5 V supply options, enabling flexibility in system power design.
  • Package & Mounting 78 Ball BGA package with surface-mount mounting type for compact PCB integration.
  • Qualification & Grade JEDEC-qualified and rated as Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • System Memory for Electronic Devices Used as DRAM memory in electronic systems requiring a 2Gb DDR3L device with a 78 Ball BGA footprint.
  • Embedded Memory Subsystems Fits embedded designs needing a 256M × 8 organization and JEDEC-qualified DDR3L operation.
  • Commercial-Grade Consumer and Industrial Electronics Applicable where commercial temperature range (0 °C to 85 °C) and RoHS compliance are required.

Unique Advantages

  • Flexible Voltage Support: Operates at 1.35 V and 1.5 V to match system power rails and design constraints.
  • High-Frequency Operation: 933 MHz clock frequency (DDR3(L)-1866) for timing-sensitive memory subsystems.
  • Compact BGA Packaging: 78 Ball BGA surface-mount package enables dense PCB layouts and space-efficient integration.
  • JEDEC Qualification: Standardized qualification simplifies integration into JEDEC-compliant memory designs.
  • Defined Commercial Temperature Range: Rated 0 °C to 85 °C for stable operation in commercial applications.
  • RoHS Compliant: Meets environmental compliance requirements for lead-free designs.

Why Choose M15T2G8256A-DEBG2D?

The M15T2G8256A-DEBG2D combines a 2.147 Gbit DDR3L architecture, 933 MHz clock support, and dual-voltage operation in a compact 78 Ball BGA package. Its JEDEC qualification and RoHS compliance provide clear, verifiable attributes for system designers seeking a standardized, commercially graded DRAM component.

This device is well suited for designs that require a mid-density, parallel-interface DRAM with defined timing parameters and a commercial operating range. Its packaging and electrical options support integration into space-constrained PCBs while maintaining deterministic operating characteristics.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the M15T2G8256A-DEBG2D.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1998


    Headquarters: Hsinchu Science Park, Hsinchu, Taiwan


    Employees: 400+


    Revenue: $377.8 Million


    Certifications and Memberships: N/A


    Featured Products
    Latest News
    keyboard_arrow_up