M15T2G8256A-DEBG2D
| Part Description |
DDR3L SDRAM 2Gb (256M × 8) 933 MHz 78 Ball BGA |
|---|---|
| Quantity | 847 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 78 Ball BGA | Memory Format | DRAM | Technology | DDR3L | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 2 Gbit | Access Time | 13.75 ns | Grade | Commercial | ||
| Clock Frequency | 933 MHz | Voltage | 1.35V, 1.5V | Memory Type | Volatile | ||
| Operating Temperature | 0°C – 85°C | Write Cycle Time Word Page | 15 ns | Packaging | 78 Ball BGA | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 256M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.36 |
Overview of M15T2G8256A-DEBG2D – DDR3L SDRAM 2Gb (256M × 8) 933 MHz 78 Ball BGA
The M15T2G8256A-DEBG2D is a DDR3L SDRAM device with a 2.147 Gbit memory density organized as 256M × 8. Implemented in DDR3L technology, it supports a 933 MHz clock frequency and is offered in a 78 Ball BGA surface-mount package.
This JEDEC-qualified, commercial-grade DRAM is designed for system memory applications where a compact BGA footprint, dual-voltage support, and defined operating temperature range are required.
Key Features
- Memory Density & Organization 2.147 Gbit capacity organized as 256M × 8, suitable for moderate-density memory subsystems.
- Clock Frequency & Timing Supports a 933 MHz clock frequency with an access time of 13.75 ns and a write cycle time (word page) of 15 ns.
- DDR3L Technology Implemented in DDR3L SDRAM technology and identified for DDR3(L)-1866 operation.
- Voltage Supply Supports 1.35 V and 1.5 V supply options, enabling flexibility in system power design.
- Package & Mounting 78 Ball BGA package with surface-mount mounting type for compact PCB integration.
- Qualification & Grade JEDEC-qualified and rated as Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- System Memory for Electronic Devices Used as DRAM memory in electronic systems requiring a 2Gb DDR3L device with a 78 Ball BGA footprint.
- Embedded Memory Subsystems Fits embedded designs needing a 256M × 8 organization and JEDEC-qualified DDR3L operation.
- Commercial-Grade Consumer and Industrial Electronics Applicable where commercial temperature range (0 °C to 85 °C) and RoHS compliance are required.
Unique Advantages
- Flexible Voltage Support: Operates at 1.35 V and 1.5 V to match system power rails and design constraints.
- High-Frequency Operation: 933 MHz clock frequency (DDR3(L)-1866) for timing-sensitive memory subsystems.
- Compact BGA Packaging: 78 Ball BGA surface-mount package enables dense PCB layouts and space-efficient integration.
- JEDEC Qualification: Standardized qualification simplifies integration into JEDEC-compliant memory designs.
- Defined Commercial Temperature Range: Rated 0 °C to 85 °C for stable operation in commercial applications.
- RoHS Compliant: Meets environmental compliance requirements for lead-free designs.
Why Choose M15T2G8256A-DEBG2D?
The M15T2G8256A-DEBG2D combines a 2.147 Gbit DDR3L architecture, 933 MHz clock support, and dual-voltage operation in a compact 78 Ball BGA package. Its JEDEC qualification and RoHS compliance provide clear, verifiable attributes for system designers seeking a standardized, commercially graded DRAM component.
This device is well suited for designs that require a mid-density, parallel-interface DRAM with defined timing parameters and a commercial operating range. Its packaging and electrical options support integration into space-constrained PCBs while maintaining deterministic operating characteristics.
Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the M15T2G8256A-DEBG2D.
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