M15T2G8256A (2D)

The M15T2G8256A (2D) from ESMT is a DDR3 SDRAM device organized as 256M × 8 with a total density of 2.147 Gbit. It implements parallel DRAM architecture and is supplied in a 78-ball BGA surface-mount package.

Targeted for commercial-grade memory applications, this JEDEC-qualified component provides a 1.066 GHz clock interface, defined access and write timings, and operates from a 1.35V supply within a 0°C to 85°C operating range.

Key Features

• Memory Core DDR3 SDRAM technology, volatile DRAM organized as 256M × 8 for a total capacity of 2.147 Gbit.
• Performance Characteristics Clock frequency rated at 1.066 GHz with an access time of 13.75 ns and a write cycle time (word page) of 15 ns.
• Power Operates from a 1.35V supply as specified.
• Interface and Format Parallel memory interface implemented in a standard DDR3 SDRAM configuration.
• Package and Mounting Supplied in a 78 Ball BGA package for surface-mount PCB assembly.
• Qualification and Compliance JEDEC-qualified component, RoHS-compliant and specified for commercial-grade operation.
• Operating Range Specified operating temperature range of 0°C to 85°C.

Typical Applications

• Commercial embedded systems — Memory expansion and main DRAM function in commercial electronic designs that require JEDEC-standard DDR3 modules.
• Consumer electronics — Use as system DRAM in commercial consumer devices where 2.147 Gbit capacity and defined timing are required.
• Communications and networking equipment — Buffering and temporary data storage in commercial networking hardware compatible with DDR3 SDRAM.

Unique Advantages

• Defined DDR3 architecture: JEDEC-qualified DDR3 SDRAM organization (256M × 8) simplifies system-level memory integration.
• Established capacity: 2.147 Gbit density provides a clear memory sizing option for commercial designs.
• Measured performance metrics: 1.066 GHz clock rating with 13.75 ns access time and 15 ns write cycle time for predictable timing behavior.
• Surface-mount BGA package: 78 Ball BGA package supports compact PCB layouts and standard assembly processes.
• Commercial temperature and compliance: 0°C to 85°C operating range and RoHS compliance align with typical commercial production requirements.

Why Choose M15T2G8256A (2D)?

The M15T2G8256A (2D) combines JEDEC-qualified DDR3 SDRAM architecture with a 2.147 Gbit density and defined timing characteristics to support commercial electronic designs that require standardized DDR3 memory. Its 78 Ball BGA surface-mount package and 1.35V supply specification make it a straightforward option for systems designed around DDR3 memory interfaces.

This part is suitable for designers and procurement teams specifying commercial-grade DDR3 memory where clear, verifiable electrical and timing specifications are required for system integration and BOM definition.

Request a quote or submit an inquiry to obtain pricing and availability for M15T2G8256A (2D) for your next commercial DDR3 memory design.