M15T2G8256A-DEBG2R

The M15T2G8256A-DEBG2R is a 2Gb DDR3(L) SDRAM device organized as 256M×8 with eight banks and a 78-ball BGA package. It delivers DDR3(L)-1866 performance (933 MHz clock) and is JEDEC DDR3(L) compliant.

Designed for compact memory subsystems, the device supports both 1.35V and 1.5V supply modes and provides programmable timing and signal integrity features for system integration and high-speed operation.

Key Features

• Memory Core & Organization  2.147 Gbit device organized as 256M×8 with eight banks and a page size of 1 KB; 8n prefetch architecture for double-data-rate transfers.
• Performance  Clock frequency 933 MHz (DDR3(L)-1866 data rate, 13-13-13 timing for this ordering option); access time listed at 13.75 ns and write cycle time (word page) at 15 ns.
• Voltage & Power Modes  Supports SSTL_135 (VDD/VDDQ = 1.35V) and SSTL_15 (VDD/VDDQ = 1.5V) operation with power-saving modes including Auto Refresh, Self Refresh, Partial Array Self Refresh (PASR) and Power Down.
• Signal & I/O  Differential clock (CK/CK) and data strobe (DQS/DQS) pairs, source-synchronous DQ transfers and double-data-rate operation on DQs, DQS and DM.
• Signal Integrity & Calibration  Configurable drive strength (DS), configurable on-die termination (ODT), and ZQ calibration for DS/ODT impedance accuracy via external ZQ pad.
• Leveling & Synchronization  Write leveling (programmable via mode registers) and read leveling (MPR) support to aid timing alignment in systems.
• Programmability  Programmable CAS latencies, CAS write latencies, additive latency, write recovery times, burst type/length and selectable on-die termination values as detailed in the device mode register options.
• Package & Mounting  78 Ball BGA package, surface mount, Pb‑free and RoHS compliant.
• Operating Range  Rated for an operating temperature range of −40°C to 105°C.
• Standards  JEDEC DDR3(L) compliant.

Typical Applications

• General memory subsystems  Use as high-density DDR3(L) main memory in compact board-level designs requiring JEDEC‑compliant DRAM.
• High-speed data buffering  Suitable where DDR3(L)-1866 data rates and source-synchronous DQS timing are required for burst transfers.
• Compact module and board designs  78-ball BGA footprint enables dense, surface-mount integration in space-constrained systems.

Unique Advantages

• Dual supply flexibility: Supports both 1.35V and 1.5V operation, allowing designers to select the appropriate VDD for system power and compatibility constraints.
• JEDEC compliance: Conformance to DDR3(L) standards simplifies integration with JEDEC-compliant controllers and ecosystem components.
• Programmable timing and termination: Extensive mode register options and configurable ODT/DS provide flexibility to tune performance and signal integrity for target platforms.
• Wide operating temperature: −40°C to 105°C rating supports deployment in designs requiring extended temperature capability.
• Compact Pb‑free BGA package: 78-ball BGA enables high-density board layouts while meeting RoHS and Pb‑free requirements.

Why Choose M15T2G8256A-DEBG2R?

The M15T2G8256A-DEBG2R offers a JEDEC-compliant DDR3(L) building block that combines 2Gb density, DDR3(L)-1866 performance, and programmable timing/termination options in a compact 78-ball BGA package. Its dual-voltage support, signal calibration features and leveling capabilities make it a practical choice where flexible memory timing and reliable high-speed transfers are required.

This part is suited to designs calling for a compact, standards-based DDR3(L) DRAM solution with extended temperature capability and a broad set of programmable controls for integration and signal integrity tuning.

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