M16U4G16256A-2400

The M16U4G16256A-2400 from ESMT is an industrial-grade DDR4 SDRAM device organized as 256M × 16 for a total density of 4.295 Gbit. It provides JEDEC-compliant DDR4 architecture with 8 internal banks, differential clocking and differential DQS, and is designed for surface-mount integration in 96-ball BGA packages.

With nominal 1.2 V operation and an extended operating case temperature range of -40°C to +95°C, this memory device targets industrial and embedded designs that require validated DDR4 timing flexibility and robust signaling options for high-speed parallel memory interfaces.

Key Features

• Memory Organization 
  4.295 Gbit density arranged as 256M × 16 with 8 internal banks and a page size of 2 KB per bank.
• DDR4 Architecture & Timing 
  DDR4 SDRAM technology with supported CAS latencies (CL) ranging from 9 to 24, additive latency (AL) options, burst lengths 8 and 4, and CAS write latency (CWL) options documented in the series datasheet.
• Clock and Performance 
  Clock frequency 1.2 GHz with access time and cycle timing characteristics suitable for DDR4-2400 operation as described in the series information (access time 14.16 ns; write cycle time 15 ns).
• Power and Voltage 
  Nominal VDD/VDDQ = 1.2 V ±5% (series datasheet); VPP and internal reference arrangements supported for DDR4 operation.
• Signal Integrity & Calibration 
  On-die termination (nominal, park and dynamic ODT), ZQ calibration with external reference resistance, and adjustable internal VREFDQ to support stable high-speed signaling.
• High-speed Interface Features 
  Differential clock inputs (CK_t/CK_c), bi-directional differential DQS, pseudo open-drain (POD) DQ interface, write leveling, and command/address parity for error detection.
• Reliability & Refresh 
  Fine granularity refresh, temperature-controlled refresh (TCR), Low Power Auto Self Refresh (LPASR) and self-refresh abort are supported to manage refresh behavior across temperature ranges.
• Programmability & Diagnostics 
  Multipurpose register read/write, programmable preamble, driver strength selection via MRS, data bus inversion (DBI) on x16 devices, data mask (DM), and write CRC for high-speed error detection.
• Package & Environmental 
  Surface-mount 96 Ball BGA package; RoHS-compliant. JEDEC JESD-79-4 compliance stated in the series documentation.

Typical Applications

• Industrial Control 
  Memory for controllers, PLCs and embedded modules that require operation across -40°C to +95°C.
• Networking and Communications 
  High-speed DDR4 buffering and packet memory where differential clocking, DQS, and write CRC support reliable data paths.
• Embedded Systems 
  General-purpose DDR4 main or working memory in industrial embedded platforms using a 96-ball BGA surface-mount footprint.

Unique Advantages

• Industrial Temperature Range 
  Specified to operate from -40°C to +95°C (series datasheet), enabling deployment in harsh environments without compromise to DDR4 timing features.
• Flexible Timing Support 
  Wide range of supported CAS, AL and CWL settings gives designers the flexibility to tune performance and timing for system needs.
• Robust Signaling & On-die Calibration 
  ZQ calibration, ODT and adjustable VREFDQ improve signal integrity at high data rates and simplify board-level tuning.
• JEDEC Compliance 
  Conforms to JEDEC JESD-79-4 series guidance (per datasheet), easing integration into standard DDR4 memory controllers and ecosystems.
• Compact, SMT-ready Package 
  96 Ball BGA surface-mount package supports high-density board layouts and automated assembly processes.
• Manufactured by ESMT 
  Part of the ESMT DDR4 SDRAM family, providing consistent series-level features and documentation for design verification.

Why Choose M16U4G16256A-2400?

The M16U4G16256A-2400 combines JEDEC-compliant DDR4 functionality, flexible timing options and on-die calibration with an industrial operating temperature range and a compact 96-ball BGA package. It is suited to engineers specifying reliable, high-speed parallel memory for industrial embedded systems, networking equipment and other applications that require validated DDR4 behavior across extended temperatures.

With a 4.295 Gbit density in a 256M × 16 organization, nominal 1.2 V operation, and series-level features such as differential clocking, DQS, ODT and refresh management, this ESMT device provides a clear specification set for system integration and long-term design stability.

Request a quote or submit a purchase inquiry to evaluate M16U4G16256A-2400 for your next industrial DDR4 design.