M52D5123216A-6BG
| Part Description |
LPSDR SDRAM 512Mbit (4M×32×4 Banks), 166 MHz, 1.8 V, 90‑Ball BGA, Commercial |
|---|---|
| Quantity | 562 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 90-BGA (8x13) | Memory Format | DRAM | Technology | DRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 1.7V ~ 1.95V | Memory Type | Volatile | ||
| Operating Temperature | 0°C – 70°C | Write Cycle Time Word Page | 12 ns | Packaging | 90-BGA | ||
| Mounting Method | Surface Mount | Memory Interface | LVCMOS | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | JEDEC | ECCN | EAR99 | HTS Code | 8542.32.00.28 |
Overview of M52D5123216A-6BG – LPSDR SDRAM 512Mbit (4M×32×4 Banks), 166 MHz, 1.8 V, 90‑Ball BGA, Commercial
The M52D5123216A-6BG is a synchronous low-power SDRAM device providing 536,870,912 bits (512 Mbit) of memory organized as 4,194,304 words × 32 bits across 4 banks. It implements a synchronous DRAM architecture with a 166 MHz clock rate and LVCMOS-compatible I/O to support timed, high-data-rate system cycles.
Designed for commercial-grade embedded and mobile applications, the device offers programmable burst lengths and latencies, multiple low-power modes and a compact 90-ball BGA (8 mm × 13 mm × 1.0 mm, 0.8 mm ball pitch) package suitable for space-constrained designs.
Key Features
- Memory Core — 536,870,912‑bit (512 Mbit) SDRAM organized as 4M × 32 with four banks for concurrent bank operations and improved effective throughput.
- Performance — Specified for 166 MHz operation with an access time of 5 ns and a write cycle time (word page) of 12 ns; supports CAS latency values of 2 and 3.
- Programmable Burst and Modes — Supports burst lengths of 1, 2, 4, 8 and full page with sequential and interleave burst types; MRS and EMRS cycles for mode programming.
- Low‑Voltage Operation — Operates across a 1.7 V to 1.95 V supply range (nominal 1.8 V) to match low-voltage system designs.
- Power Management — Features Deep Power Down (DPD) mode, auto and self refresh, PASR (Partial Array Self Refresh) and TCSR (Temperature Compensated Self Refresh) for flexible power/state control.
- Interface and Control — LVCMOS-compatible inputs with multiplexed address pins (A0–A12), DQM masking, BA0/BA1 bank select, and inputs sampled on the positive edge of CLK for synchronous timing.
- Package and Temperature — 90-ball BGA (8 mm × 13 mm × 1.0 mm body, 0.8 mm ball pitch) surface-mount package; commercial operating temperature range 0 °C to 70 °C.
- Standards and Compliance — JEDEC-qualified design and RoHS-compliant materials.
- Refresh — Supports standard auto/self refresh with a 64 ms refresh period (8K cycle).
Typical Applications
- Mobile and Handheld Devices — Mobile SDRAM architecture and low-voltage 1.8 V operation make the device suitable for compact battery-powered designs requiring synchronous high-data-rate memory.
- Consumer Electronics — Useful for embedded memory in consumer products that need a small-footprint BGA package and configurable burst/latency settings for varying workload demands.
- Multimedia and Graphics Buffers — Four-bank organization and programmable burst modes support applications that require sustained data transfer and predictable synchronous timing.
- Embedded Systems — Commercial-grade operating range and JEDEC qualification make the device appropriate for a wide range of embedded system memory needs.
Unique Advantages
- High-density SDRAM in a compact package: 512 Mbit capacity in a 90-ball BGA (8×13 mm) reduces PCB area while providing large on-board memory.
- Flexible timing and burst options: Programmable CAS latency and burst lengths allow tuning for different throughput and latency trade-offs in system designs.
- Comprehensive low-power features: Deep Power Down, PASR and TCSR plus auto/self refresh modes enable multiple strategies for reducing active and idle power.
- Precise synchronous operation: Inputs sampled on the positive edge of CLK and LVCMOS-compatible interface deliver deterministic timing for clocked memory systems.
- JEDEC-qualified and RoHS-compliant: Industry-standard qualification and materials compliance support reliable integration into commercial products.
Why Choose M52D5123216A-6BG?
The M52D5123216A-6BG provides a balanced combination of density, synchronous performance and low-voltage operation for commercial embedded and mobile applications. Its four-bank organization, programmable latency and burst modes make it adaptable to a range of memory access patterns while the compact 90-ball BGA package helps optimize board real estate.
This device is suitable for designers who require JEDEC-qualified SDRAM with flexible power-management options and predictable synchronous timing at 166 MHz. Its combination of features supports scalable system designs with a focus on integration, timing control and standard-compliant implementation.
Request a quote or submit an inquiry to obtain pricing, lead times and additional technical details for the M52D5123216A-6BG.
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
Employees: 400+
Revenue: $377.8 Million
Certifications and Memberships: N/A