M52D64322A (2S)

64Mb SDRAM
Part Description

LPSDR SDRAM 1.8V

Quantity 467 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package54 Ball FBGAMemory FormatDRAMTechnologyLPSDR SDRAM
Memory Size64 MbitAccess TimeN/AGradeCommercial
Clock Frequency166 MHzVoltage2.5VMemory TypeVolatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page15 nsPackaging54 Ball FBGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization2M x 32
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationJEDECECCNEAR99HTS Code8542.32.00.02

Overview of M52D64322A (2S) – LPSDR SDRAM 1.8V

The M52D64322A (2S) is a volatile LPSDR SDRAM memory device from ESMT, organized as 2M × 32 and presented in a parallel DRAM format. It is a commercial-grade, JEDEC-qualified memory product intended for use where compact, mid-density SDRAM is required.

With a 67.11 Mbit capacity, a 166 MHz clock rating and a 15 ns write cycle (word/page), this device targets commercial memory applications that benefit from predictable timing and a compact BGA footprint.

Key Features

  • Memory Architecture 2M × 32 organization delivering 67.11 Mbit of volatile DRAM capacity in a parallel memory format.
  • Performance 166 MHz clock frequency and a 15 ns write cycle time (word/page) for deterministic timing characteristics.
  • Technology LPSDR SDRAM technology in a standard DRAM format.
  • Power 2.5V nominal supply voltage as specified for the device.
  • Package & Mounting 54 Ball FBGA package supplied for surface-mount PCB assembly (54 Ball FBGA, surface mount).
  • Qualification & Grade JEDEC-qualified, commercial grade device with RoHS compliance.
  • Operating Range Commercial operating temperature range of 0 °C to 70 °C.

Typical Applications

  • Commercial Embedded Systems Provides mid-density SDRAM for embedded controllers and subsystem memory in commercial devices.
  • Consumer Electronics Suitable for consumer products requiring dependable parallel DRAM storage in a compact package.
  • Networking & Communications Equipment Fits applications that require predictable SDRAM timing and JEDEC qualification for system memory.

Unique Advantages

  • Compact FBGA Footprint: 54 Ball FBGA package reduces board area while supporting surface-mount assembly.
  • JEDEC Qualification: Conforms to JEDEC standards for predictable electrical and timing behavior across designs.
  • Deterministic Timing: 166 MHz clock and 15 ns write cycle time facilitate straightforward timing analysis and integration.
  • Mid-Density Capacity: 67.11 Mbit and 2M × 32 organization provide a balance of capacity and addressability for commercial designs.
  • RoHS Compliant: Environmentally compliant for designs requiring lead-free components.
  • Commercial Temperature Range: Rated 0 °C to 70 °C for standard commercial operating environments.

Why Choose M52D64322A (2S)?

The M52D64322A (2S) positions itself as a JEDEC-qualified, commercial-grade LPSDR SDRAM option that combines mid-density capacity with deterministic timing and a compact FBGA package. Its 2M × 32 organization, 166 MHz clock rating and 15 ns write cycle time make it suitable for designs that need predictable DRAM behavior in a surface-mount form factor.

Manufactured by ESMT and offered with RoHS compliance, this device is appropriate for procurement into commercial embedded, consumer, and communications products where standardized qualification and a compact package support reliable integration and supply-chain consistency.

Request a quote or submit an inquiry for M52D64322A (2S) to get pricing and availability information for your next design.

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