M54D4G32128ZA(2C)

The M54D4G32128ZA(2C) is an industrial-grade LPDDR2 SDRAM device from ESMT designed for embedded memory applications requiring JEDEC qualification and extended temperature operation. It provides 4.295 Gbit of volatile DRAM organized as 128M × 32 with a parallel memory interface.

Key characteristics include a 533 MHz clock frequency, 5.5 ns access time and a 15 ns write cycle time, delivered in a 134-ball BGA surface-mount package. The device is specified for operation from −40 °C to 85 °C and is RoHS compliant.

Key Features

• Memory Core (LPDDR2 SDRAM) 4.295 Gbit volatile DRAM organized as 128M × 32, providing a high-density memory option in LPDDR2 architecture.
• Performance 533 MHz clock frequency with a 5.5 ns access time and a 15 ns write cycle time for responsive read/write operations.
• Power Voltage supply specified at 2.5 V for device operation.
• Interface Parallel memory interface suitable for designs using LPDDR2 SDRAM signaling and topology.
• Package & Mounting 134 Ball BGA package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade Industrial-grade qualification with an operating temperature range of −40 °C to 85 °C.
• Standards & Compliance JEDEC-qualified device and RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Industrial embedded systems — Memory for controllers and modules that require operation across −40 °C to 85 °C.
• JEDEC-compliant LPDDR2 designs — Drop-in memory solution for systems specifying JEDEC LPDDR2 SDRAM qualification.
• Compact board-level modules — High-density 4.295 Gbit memory in a 134-ball BGA surface-mount package for space-constrained designs.

Unique Advantages

• Extended industrial temperature range: Engineered for reliable operation from −40 °C to 85 °C, supporting harsh-environment deployments.
• High memory density: 4.295 Gbit capacity organized as 128M × 32 enables larger data buffers and system memory without increasing footprint.
• Responsive performance: 533 MHz clock and 5.5 ns access time deliver low-latency memory access for demanding workloads.
• JEDEC qualification: Conforms to JEDEC standards, simplifying integration into standardized memory designs.
• Compact BGA packaging: 134 Ball BGA surface-mount package reduces board area while providing a robust mechanical connection.
• Regulatory compliance: RoHS compliant to support environmentally conscious manufacturing processes.

Why Choose M54D4G32128ZA(2C)?

The M54D4G32128ZA(2C) positions itself as an industrial LPDDR2 memory option that balances high-density capacity with proven JEDEC qualification and extended temperature capability. Its 4.295 Gbit organization, 533 MHz clocking and compact 134-ball BGA package make it suitable for embedded designs that require robust, board-level memory in constrained footprints.

Designed and manufactured by ESMT as part of the LPDDR2 SDRAM series, this device is appropriate for projects needing verified JEDEC compliance, predictable performance metrics, and RoHS conformity for modern manufacturing flows.

Request a quote or submit an inquiry for pricing and availability to evaluate the M54D4G32128ZA(2C) for your next design.