MT29E256G08CMCABJ2-10Z:A

IC FLASH 256GBIT PAR 132TBGA
Part Description

IC FLASH 256GBIT PAR 132TBGA

Quantity 342 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-TBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size256 GbitAccess TimeN/AGradeCommercial
Clock Frequency100 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging132-TBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29E256G08CMCABJ2-10Z:A – IC FLASH 256GBIT PAR 132TBGA

The MT29E256G08CMCABJ2-10Z:A is a 256 Gbit non-volatile NAND flash memory device in a parallel interface format. It provides high-density storage in a compact 132-TBGA (12×18) package for systems that require parallel flash memory with a 32G × 8 organization.

With a 100 MHz clock frequency and a supply voltage range of 2.7 V to 3.6 V, this device targets applications that need dense, parallel-access flash memory within a commercial operating temperature range of 0°C to 70°C.

Key Features

  • Memory Type & Technology  Non-volatile FLASH - NAND memory providing 256 Gbit of storage in a parallel flash format.
  • Memory Organization  Configured as 32G × 8 to support byte-wide parallel access patterns.
  • Interface & Performance  Parallel memory interface with a specified clock frequency of 100 MHz for synchronous operation.
  • Supply Voltage  Operates across a 2.7 V to 3.6 V supply range to match common system power rails.
  • Package  Delivered in a 132-TBGA package (12 × 18 mm footprint) for compact board-level integration.
  • Operating Temperature  Rated for commercial operation from 0°C to 70°C (TA).

Typical Applications

  • Embedded Storage Systems  Provides high-density non-volatile storage for systems requiring parallel NAND memory in a compact BGA footprint.
  • Consumer Electronics  Suitable for consumer devices that operate within a 0°C to 70°C temperature range and require large-capacity flash memory.
  • Commercial and Industrial Equipment  Can be used in commercial equipment designs that utilize a 2.7 V–3.6 V supply and parallel flash interfaces for local storage.

Unique Advantages

  • High-density 256 Gbit capacity:  Delivers substantial non-volatile storage in a single device, reducing the number of components required for large datasets.
  • Parallel 32G × 8 organization:  Byte-wide parallel access simplifies interfacing to parallel memory controllers and legacy systems.
  • Compact 132-TBGA package:  Small 12×18 mm TBGA package helps conserve PCB area while retaining high storage density.
  • Wide supply range:  Operates from 2.7 V to 3.6 V to accommodate common system power rails and reduce the need for additional power conversion.
  • Commercial temperature rating:  Specified operation from 0°C to 70°C for use in typical commercial environments.

Why Choose IC FLASH 256GBIT PAR 132TBGA?

The MT29E256G08CMCABJ2-10Z:A positions itself as a high-density parallel NAND flash option that balances storage capacity, a compact TBGA package, and standard supply/clocking requirements. Its 32G × 8 organization and 100 MHz clock frequency make it appropriate for designs that require parallel-access flash memory within a commercial temperature range.

Manufactured by Micron Technology Inc., this device suits designers and procurement teams seeking a straightforward, high-capacity parallel flash component for embedded, consumer, and commercial applications where the specified electrical and environmental limits match system requirements.

Request a quote or contact sales to discuss pricing, availability, and volume options for the MT29E256G08CMCABJ2-10Z:A.

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