MT29F256G08AUCABH3-10Z:A TR

IC FLASH 256GBIT PAR 100LBGA
Part Description

IC FLASH 256GBIT PAR 100LBGA

Quantity 91 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-LBGA (12x18)Memory FormatFLASHTechnologyFLASH - NAND (SLC)
Memory Size256 GbitAccess TimeN/AGradeCommercial
Clock Frequency100 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word PageN/APackaging100-LBGA
Mounting MethodNon-VolatileMemory InterfaceParallelMemory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MT29F256G08AUCABH3-10Z:A TR – IC FLASH 256GBIT PAR 100LBGA

The MT29F256G08AUCABH3-10Z:A TR is a 256 Gbit parallel SLC NAND flash memory device from Micron Technology Inc. It implements a 32G × 8 memory organization and provides non-volatile storage in a compact 100-LBGA (12×18) package.

This device is intended for systems requiring parallel flash memory with a 100 MHz clock interface, support for a 2.7 V to 3.6 V supply range, and operation within a 0 °C to 70 °C ambient temperature window. Its form factor and electrical characteristics support board-level integration where parallel NAND is required.

Key Features

  • Memory Core 256 Gbit non-volatile NAND flash with SLC technology; memory organized as 32G × 8.
  • Interface Parallel memory interface designed for systems using parallel NAND connectivity.
  • Clock Supports a 100 MHz clock frequency for timing and interface operations.
  • Voltage Operates from 2.7 V to 3.6 V supply, enabling compatibility with common board supply rails.
  • Package Standard 100-LBGA (12×18) supplier device package for compact board-level mounting.
  • Operating Temperature Rated for 0 °C to 70 °C (TA) ambient operation.

Typical Applications

  • Parallel memory systems — Integrates as a parallel NAND storage element in designs that require 32G × 8 organization and a 100 MHz clock interface.
  • Board-level non-volatile storage — Provides large-capacity non-volatile memory for systems needing 256 Gbit of NAND flash on a compact 100-LBGA footprint.
  • Firmware and code storage — Suited for storing program code or firmware where SLC NAND and a parallel interface are preferred.

Unique Advantages

  • High-density capacity: 256 Gbit capacity enables substantial on-board storage in a single device.
  • SLC NAND technology: Specifies SLC NAND architecture as the memory technology for the device.
  • Parallel interface compatibility: Parallel memory interface and 32G × 8 organization simplify integration with parallel memory controllers.
  • Compact package: 100-LBGA (12×18) package supports compact board layouts and standardized mounting.
  • Flexible supply range: 2.7 V to 3.6 V operation aligns with common system power rails.
  • Defined operating window: Rated for 0 °C to 70 °C ambient operation to match typical commercial-temperature designs.

Why Choose IC FLASH 256GBIT PAR 100LBGA?

The MT29F256G08AUCABH3-10Z:A TR positions itself as a high-capacity parallel SLC NAND flash component for designs that require 256 Gbit of non-volatile storage in a 100-LBGA package. Its defined electrical and thermal specifications—2.7 V to 3.6 V supply and 0 °C to 70 °C operating range—make it suitable for commercial embedded systems that employ parallel memory architectures.

This device is appropriate for engineers and procurement teams seeking a single-device solution for large on-board flash capacity with a 32G × 8 organization, a 100 MHz clock interface, and a compact LBGA footprint for board-level integration.

To request a quote or submit a purchase inquiry for MT29F256G08AUCABH3-10Z:A TR, please contact sales to obtain pricing and availability information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up