MT29F256G08AUCABJ3-10Z:A

The MT29F256G08AUCABJ3-10Z:A is a 256 Gbit parallel NAND flash device from Micron Technology Inc., implemented with single-level cell (SLC) technology. It provides high-capacity, non-volatile storage in a 132-ball BGA (12×18) package for commercial-temperature embedded systems.

This device supports both synchronous and asynchronous I/O with ONFI 2.2 compliance and a range of advanced NAND commands, making it suitable for applications that require durable, high-throughput local storage and firmware/boot media in commercial equipment.

Key Features

• Memory Type & Capacity  Non-volatile SLC NAND flash with a memory size of 256 Gbit organized as 32G × 8.
• Organization & Geometry  Page size x8: 8,640 bytes (8,192 + 448); block size: 128 pages (1,024K + 56K bytes); plane size: 2 planes × 2,048 blocks per plane; 256Gb device = 32,768 blocks.
• Interface & Protocol  Parallel memory interface with ONFI 2.2 compliance. Supports synchronous and asynchronous signaling and hardware data strobe (DQS) for synchronized data transfer.
• Performance  Synchronous I/O up to timing mode 5 with DDR clock rate of 10 ns (read/write throughput per pin up to 200 MT/s). Asynchronous I/O up to timing mode 5 (read/write throughput per pin up to 50 MT/s). Typical array timings: read page 35 µs, program page 350 µs, erase block 1.5 ms.
• Voltage  VCC operating range: 2.7 V to 3.6 V. VCCQ options: 1.7–1.95 V or 2.7–3.6 V.
• Reliability & Endurance  Endurance rated at 60,000 program/erase cycles. Data retention is JESD47G compliant. Operation status byte provides software indications for operation completion, pass/fail, and write-protect status.
• Advanced Command Set  Support for program cache, read cache (sequential and random), multi-plane and multi-LUN commands, OTP mode, read unique ID, and copyback. RESET (FFh) is required as first command after power-on.
• Package & Temperature  Supplier device package: 132-LBGA (12×18). Specified operating temperature (TA): 0°C to +70°C.

Typical Applications

• Commercial Embedded Systems  High-capacity non-volatile storage for embedded applications operating in commercial temperature ranges.
• Firmware and Boot Storage  Reliable SLC storage for firmware images, boot code, and system recovery partitions where endurance and data retention are required.
• Data Logging and Local Media  Local high-capacity storage for data buffering or logging in commercial devices that require frequent program/erase cycles and predictable performance.
• Consumer and Networking Devices  Onboard non-volatile memory for consumer electronics and networking equipment that leverage parallel NAND performance and capacity.

Unique Advantages

• High Capacity in a Compact BGA  256 Gbit in a 132-ball BGA (12×18) footprint enables dense storage with a small board area impact.
• SLC Endurance  60,000 program/erase cycles provide longevity for applications with frequent write/erase activity.
• Flexible Performance Modes  Support for synchronous DDR transfers (up to 200 MT/s per pin) and asynchronous modes allows designers to balance throughput and timing complexity.
• ONFI 2.2 Compliance  Standardized interface and DQS support simplify integration with controllers that support ONFI-compliant NAND devices.
• Comprehensive Command Feature Set  Program/read caches, multi-plane and multi-LUN operations, OTP mode, and copyback operations enable optimized flash management and system-level performance strategies.
• Robust Data Retention  JESD47G-compliant data retention helps meet reliability expectations for commercial applications.

Why Choose MT29F256G08AUCABJ3-10Z:A?

The MT29F256G08AUCABJ3-10Z:A positions itself as a high-capacity, high-endurance SLC NAND solution for commercial embedded designs that require reliable non-volatile storage with flexible performance modes. Its ONFI 2.2-compliant parallel interface, advanced command set, and documented array timings provide predictable integration and system-level behavior.

This Micron device is suited to designers who need scalable storage capacity, standardized interfaces, and endurance characteristics for firmware, boot, and local data storage in commercial-temperature equipment. The combination of SLC endurance, JESD47G data retention compliance, and a compact 132-LBGA package supports durable, long-life deployments where component-level reliability matters.

Request a quote or contact sales to discuss availability, lead times, and how this part fits your commercial embedded storage requirements.