MT29F256G08AUCDBJ6-6:D

The MT29F256G08AUCDBJ6-6:D is a 256 Gbit non-volatile NAND flash memory device implemented with SLC technology and organized as 32G × 8. It provides parallel-memory interfacing in a 132-LBGA (12×18) package for systems requiring high-density parallel flash storage.

Key electrical and environmental parameters include a 166 MHz clock frequency, a 2.7 V to 3.6 V supply range, and an operating ambient temperature range of 0°C to 70°C, enabling integration into a range of commercial-temperature designs.

Key Features

• Memory Type and Technology Non-volatile NAND flash using SLC technology, providing 256 Gbit of solid-state storage.
• Memory Organization Organized as 32G × 8, facilitating byte-wide parallel data access.
• Interface and Performance Parallel memory interface with a clock frequency specified at 166 MHz for synchronous operation.
• Voltage Supply Operates from 2.7 V to 3.6 V, supporting common 3.3 V system environments.
• Package 132-LBGA package (12×18 mm footprint) for compact board-level integration.
• Operating Temperature Rated for an ambient temperature range of 0°C to 70°C (TA).

Typical Applications

• Embedded storage systems — Parallel SLC NAND flash for high-density non-volatile data storage in embedded devices.
• Firmware and code storage — Use as on-board program or firmware storage where parallel memory access is required.
• Data logging modules — High-capacity flash for systems that accumulate and retain large datasets at commercial operating temperatures.

Unique Advantages

• High-density capacity: 256 Gbit of storage supports larger datasets and firmware images without adding multiple devices.
• Byte-wide organization: 32G × 8 organization enables straightforward parallel bus integration for byte-oriented systems.
• Synchronous parallel performance: 166 MHz clock frequency supports predictable timing for parallel-memory transactions.
• Standard power domain: 2.7 V–3.6 V supply compatibility aligns with common 3.3 V system rails.
• Compact LBGA package: 132-LBGA (12×18) reduces PCB area for high-density board designs.
• Commercial temperature rating: Rated for 0°C to 70°C ambient operation for commercial-temperature applications.

Why Choose IC FLASH 256GBIT PAR 132LBGA?

The MT29F256G08AUCDBJ6-6:D positions itself as a high-capacity parallel NAND flash option offering SLC technology in a compact 132-LBGA footprint. Its combination of 256 Gbit density, 32G × 8 organization, 166 MHz clocking, and 2.7 V–3.6 V supply requirement makes it suitable for designs that need dense, parallel-access non-volatile memory within commercial temperature ranges.

This device is appropriate for engineers specifying on-board firmware storage, embedded data retention, or other applications that require parallel NAND flash memory with a standardized package and supply voltage. The straightforward electrical and mechanical specifications support predictable integration and long-term availability planning.

For pricing, lead time, or to request a formal quote, please submit a quote request or contact the supplier’s sales channel for more information.