MT29F256G08CECABH6-6:A

The MT29F256G08CECABH6-6:A is a 256 Gbit, parallel NAND flash memory device implemented in MLC (multi-level cell) FLASH technology. It is organized as 32G × 8 and operates with a clock frequency of 166 MHz, providing high-capacity non-volatile storage in a compact VBGA package.

This device targets designs that require large-density parallel flash storage with standard 2.7 V to 3.6 V supply compatibility and a 152-VBGA (14×18) package footprint. Operating ambient range is specified from 0°C to 70°C.

Key Features

• Memory Technology  FLASH - NAND (MLC) non-volatile memory optimized for high-density storage applications.
• Density & Organization  256 Gbit total capacity organized as 32G × 8 to simplify system addressing and memory mapping.
• Interface & Performance  Parallel memory interface with a specified clock frequency of 166 MHz for synchronous operation with parallel host controllers.
• Voltage Supply  Operates from 2.7 V to 3.6 V, enabling compatibility with common system power rails.
• Package  152-VBGA package (14×18 mm) providing a compact, ball-grid array footprint for board-level integration.
• Operating Temperature  Rated for ambient operation from 0°C to 70°C.

Typical Applications

• High-capacity storage systems  Used where large non-volatile parallel FLASH capacity is required for data storage or content distribution.
• Embedded storage  Suitable for embedded systems that require MLC NAND for firmware, filesystem, or bulk data retention.
• Data logging and archival  Applicable in designs that need sustained non-volatile capacity within the specified temperature and voltage ranges.

Unique Advantages

• High-density capacity: 256 Gbit total provides substantial non-volatile storage in a single device, reducing the need for multiple components.
• Parallel interface support: Parallel memory interface enables integration with legacy or parallel-host controllers without serial-to-parallel translation.
• Industry-standard supply range: 2.7 V to 3.6 V operation matches common system power rails for straightforward power design.
• Compact VBGA footprint: 152-VBGA (14×18) package offers high-density integration for space-constrained PCBs.
• Defined operating range: Specified 0°C to 70°C ambient temperature rating helps align component selection with typical commercial-temperature designs.

Why Choose MT29F256G08CECABH6-6:A?

The MT29F256G08CECABH6-6:A positions itself as a high-density, parallel NAND flash option for designs requiring 256 Gbit of MLC storage in a compact VBGA package. Its parallel interface, 166 MHz clock rating, and standard 2.7 V–3.6 V supply range make it suitable for systems that need substantial non-volatile capacity with straightforward electrical integration.

Choose this device for applications where consolidation of storage into a single package, predictable operating limits (0°C to 70°C), and a compact 152-VBGA footprint are priorities for design simplicity and board-space efficiency.

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