MT29F256G08CECBBH6-6R:B

The MT29F256G08CECBBH6-6R:B is a 256 Gbit non-volatile NAND flash memory device implemented with MLC technology and a parallel interface. It provides high-density storage in a 152-VBGA (14×18) package and is specified for operation from 0°C to 70°C with a supply voltage range of 2.7 V to 3.6 V.

With a memory organization of 32G × 8 and a clock frequency of 167 MHz, this device targets systems that require large-capacity parallel flash storage in a compact BGA footprint.

Key Features

• Memory Core 
  256 Gbit capacity organized as 32G × 8 using NAND flash (MLC) technology, providing large on-board non-volatile storage.
• Interface 
  Parallel memory interface supporting system integration where parallel NAND access is required.
• Performance 
  Specified clock frequency of 167 MHz to support device timing requirements in parallel memory systems.
• Power 
  Supply voltage range of 2.7 V to 3.6 V to match common system power rails.
• Package & Mounting 
  152-VBGA (14×18) supplier device package for board-level mounting and compact footprint.
• Operating Range 
  Rated for an ambient operating temperature range of 0°C to 70°C (TA).

Typical Applications

• High-density parallel flash storage 
  Used where 256 Gbit non-volatile storage is required with a parallel interface for system memory expansion.
• Board-level mass storage 
  Suitable for board-mounted designs that need a compact 152-VBGA package and large memory capacity.
• Firmware and image storage 
  Appropriate for storing large firmware or image data sets given the 32G × 8 organization and MLC NAND format.

Unique Advantages

• Large on-chip capacity: 256 Gbit density enables consolidation of storage requirements onto a single device, reducing board-level component count.
• Parallel interface flexibility: Parallel memory organization fits designs that use parallel NAND connectivity and timing architectures.
• Industry-standard package: 152-VBGA (14×18) provides a compact BGA form factor for space-constrained assemblies.
• Broad supply range: 2.7 V to 3.6 V compatibility with common power rails simplifies power-system design.
• Specified operating temperature: 0°C to 70°C rating supports typical commercial-temperature applications.

Why Choose IC FLASH 256GBIT PAR 152VBGA?

The MT29F256G08CECBBH6-6R:B combines high-density 256 Gbit MLC NAND storage with a parallel interface and a compact 152-VBGA package, making it suited to designs that require substantial non-volatile capacity in a board-mounted form factor. Its electrical and timing specifications—32G × 8 organization, 167 MHz clock frequency, and 2.7 V–3.6 V supply range—allow integration into systems with existing parallel NAND architectures.

This device is appropriate for engineers specifying large-capacity flash for firmware, image storage, or mass-storage consolidation in commercial-temperature environments where a compact BGA package and standard supply voltages are required.

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