MT29F256G08CECCBH6-6C:C

The MT29F256G08CECCBH6-6C:C is a 256 Gbit parallel NAND flash memory device implemented in MLC flash technology. It provides a 32G x 8 memory organization with a parallel memory interface and operates from a 2.7 V to 3.6 V supply.

This device is suitable for designs that require high-density, non-volatile parallel flash storage in a compact 152-VBGA (14×18) package, with an operating ambient temperature range of 0°C to 70°C and a clock frequency rating of 167 MHz.

Key Features

• Memory Type & Technology 256 Gbit non-volatile FLASH using NAND MLC technology for multi-level cell storage.
• Memory Organization Organized as 32G × 8 to provide the stated density and byte-wide parallel access.
• Interface & Performance Parallel memory interface with a specified clock frequency of 167 MHz for synchronous access timing.
• Power Wide supply voltage range of 2.7 V to 3.6 V to accommodate common system rails.
• Package 152-VBGA package (14×18 mm) for board-level integration where compact BGA mounting is required.
• Operating Temperature Rated for ambient operation from 0°C to 70°C (TA) for commercial temperature range applications.
• Memory Format FLASH memory format with parallel interface for direct board connection to parallel memory controllers.

Typical Applications

• Parallel non-volatile storage — Used as high-density parallel flash memory for systems requiring 256 Gbit of non-volatile storage.
• Board-level flash integration — The 152-VBGA (14×18) package supports compact PCB layouts and BGA assembly processes.
• Embedded system storage — Provides on-board FLASH storage where a parallel interface and 2.7 V–3.6 V supply compatibility are required.

Unique Advantages

• High storage density: 256 Gbit capacity delivered in a single device supports high-capacity storage needs without multiple parts.
• Parallel interface compatibility: 32G × 8 organization and parallel interface enable direct integration with parallel memory controllers and legacy designs.
• Compact BGA package: 152-VBGA (14×18) package minimizes PCB footprint while providing reliable BGA mounting.
• Flexible supply range: 2.7 V to 3.6 V operation fits common system power rails, simplifying power design.
• Commercial temperature rating: 0°C to 70°C ambient operation supports a wide range of indoor and controlled-environment applications.
• Specified clock frequency: 167 MHz clock rating provides a defined timing target for system integration.

Why Choose IC FLASH 256GBIT PAR 152VBGA?

The MT29F256G08CECCBH6-6C:C positions itself as a high-density, parallel NAND flash solution suitable for designs that require 256 Gbit of non-volatile storage in a compact 152-VBGA package. Its 32G × 8 organization, 167 MHz clock rating, and 2.7 V–3.6 V supply range make it appropriate for systems that need byte-wide parallel access and common voltage compatibility.

This device is well-suited to engineers and procurement teams specifying board-level parallel flash memory where package size, storage density, and clear electrical and temperature ratings are primary selection criteria.

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