MT29F256G08CEECBH6-12:C TR
| Part Description |
IC FLASH 256GBIT PAR 152VBGA |
|---|---|
| Quantity | 28 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 152-VBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND (MLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Commercial | ||
| Clock Frequency | 83 MHz | Voltage | 2.5V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 152-VBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | Parallel | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MT29F256G08CEECBH6-12:C TR – IC FLASH 256GBIT PAR 152VBGA
The MT29F256G08CEECBH6-12:C TR is a 256 Gbit non-volatile NAND flash memory device implemented as MLC (multi-level cell) flash. It provides high-density parallel flash storage in a 152-VBGA (14×18) package suited for systems that require large onboard data or code storage with a parallel memory interface.
Key device attributes include a 32G × 8 memory organization, parallel interface operation at an 83 MHz clock rate, and a supply voltage range of 2.5 V to 3.6 V, optimized for integration into embedded and system designs with defined operating-temperature limits.
Key Features
- Memory Type: Non-volatile NAND flash implemented as MLC (multi-level cell), providing higher density per die compared to single-level cell organizations.
- Memory Organization & Size: 32G × 8 organization delivering a total memory capacity of 256 Gbit for large code or data storage requirements.
- Interface & Performance: Parallel memory interface with a clock frequency of 83 MHz for synchronous parallel access.
- Voltage Supply: Operates across a supply range of 2.5 V to 3.6 V, enabling compatibility with common system power rails.
- Package & Mounting: 152-VBGA package (14×18) providing a compact BGA footprint for surface-mount PCB designs.
- Operating Temperature: Rated for operation from 0°C to 70°C (TA), suitable for standard commercial-temperature applications.
- Memory Format: FLASH, specifically organized as parallel NAND for use in parallel flash architectures.
Unique Advantages
- High-density storage: 256 Gbit capacity supports large onboard code and data storage needs within a single device.
- Parallel interface compatibility: 32G × 8 organization and parallel I/O facilitate integration into systems that use parallel flash memory architectures.
- Flexible supply range: 2.5 V to 3.6 V operation allows use with multiple common system voltage rails.
- Compact BGA footprint: 152-VBGA (14×18) package enables space-efficient PCB layouts for high-density designs.
- Defined operating window: Specified 0°C to 70°C temperature range supports deployment in commercial-temperature environments.
- MLC NAND technology: Multi-level cell implementation increases storage density per die for applications requiring large capacity.
Why Choose IC FLASH 256GBIT PAR 152VBGA?
The MT29F256G08CEECBH6-12:C TR is positioned for designs that require a high-capacity, parallel NAND flash device in a compact BGA package. Its 256 Gbit MLC architecture, 32G × 8 organization, and 83 MHz parallel interface make it suitable for systems needing significant non-volatile storage while operating within a 2.5 V–3.6 V power envelope and 0°C–70°C temperature range.
This device is appropriate for engineers and procurement teams targeting robust, high-density parallel flash integration where package footprint, supply compatibility, and a clearly defined operating range are important considerations.
If you would like pricing, availability, or a formal quote for the MT29F256G08CEECBH6-12:C TR, please request a quote or contact sales to discuss options and lead times.
